Infineon SIPMOS N-Channel MOSFET, 110 mA, 240 V Enhancement, 3-Pin SOT-23

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Subtotal (250 units, on reels of 250)*

₩59,500.00

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250 - 500₩238.00₩59,400.00
750 - 1250₩232.00₩57,900.00
1500 +₩228.00₩57,000.00

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
827-0070
Distrelec 제품 번호:
304-44-424
제조사 부품 번호:
BSS131H6327XTSA1
제조업체:
Infineon
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브랜드

Infineon

Product Type

MOSFET

Channel Type

N

Maximum Continuous Drain Current Id

110mA

Maximum Drain Source Voltage Vds

240V

Series

SIPMOS

Package Type

SOT-23

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

20Ω

Channel Mode

Enhancement

Forward Voltage Vf

810mV

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

360mW

Typical Gate Charge Qg @ Vgs

2.1nC

Maximum Gate Source Voltage Vgs

-20V, +20V

Maximum Operating Temperature

150°C

Length

2.9mm

Height

1mm

Standards/Approvals

No

Width

1.3mm

Automotive Standard

AEC-Q101

Infineon SIPMOS Series MOSFET, 240V Maximum Drain Source Voltage, 110mA Maximum Continuous Drain Current - BSS131H6327XTSA1


This MOSFET is a high-voltage N-channel enhancement-mode transistor designed for surface-mount power switching in compact electronics. It operates across a wide temperature span suited to demanding environments and is intended for applications requiring controlled drain-source conduction with a moderate continuous current capability.

Features and Benefits:


• 240V drain-source rating enables high-voltage switching
• 110 mA continuous drain capability supports low-current loads
• 20V gate-source limit protects against excessive gate stress
• 20 Ω maximum RDS(on) simplifies thermal management at low currents
• 2.1 nC typical gate charge reduces drive energy requirements
• 360 mW power dissipation suits small form-factor thermal budgets

Applications


• Suitable for automotive sensor power switching
• Ideal for battery-management control circuitry
• Used for low-current motor-driver gate stages
• Can be used for level-shift and protection functions
• Used with handheld and portable instrumentation

What package and mounting method does it use for PCB assembly?


It is supplied in a SOT-23 package configured for surface-mount placement to suit automated soldering processes.

What environmental extremes can it withstand during operation?


The device is rated to operate from -55 °C up to 150 °C to accommodate wide thermal excursions.

How compact is the device for space-constrained designs?


The package footprint measures 2.9mm in length and 1.3mm in width while the component height is 1.0mm for tight-layout applications.

Does it meet any automotive qualification standard for vehicle use?


It conforms to the AEC‑Q101 automotive standard for semiconductor stress screening.

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