Bergquist TSP 1800 Series Self-Adhesive Thermal Interface Pad, 0.012 in Thick, 1.8 W/mK, 12 in, 12in, Silicone
- RS 제품 번호:
- 282-6865
- 제조사 부품 번호:
- SIL PAD TSP 1800, 12in x 12in x 0.012 aca
- 제조업체:
- Bergquist
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- RS 제품 번호:
- 282-6865
- 제조사 부품 번호:
- SIL PAD TSP 1800, 12in x 12in x 0.012 aca
- 제조업체:
- Bergquist
사양
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Bergquist | |
| Product Type | Thermal Interface Pad | |
| Thickness | 0.012in | |
| Thermal Conductivity | 1.8W/mK | |
| Self-Adhesive | Yes | |
| Trade Name | TSP 1800 | |
| Conductive Material | Silicone | |
| Width | 12in | |
| Standards/Approvals | No | |
| Length | 12in | |
| Series | TSP 1800 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Bergquist | ||
Product Type Thermal Interface Pad | ||
Thickness 0.012in | ||
Thermal Conductivity 1.8W/mK | ||
Self-Adhesive Yes | ||
Trade Name TSP 1800 | ||
Conductive Material Silicone | ||
Width 12in | ||
Standards/Approvals No | ||
Length 12in | ||
Series TSP 1800 | ||
제외
- COO (Country of Origin):
- US
The Bergquist silicone based fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use as well as an optional adhesive coating. It exhibits exceptional thermal performance at low and high application pressures. The material is ideal for placement between electronic power devices and a heat sink for screw and clip mounted applications.
Exceptional thermal performance at lower application pressures
Smooth and non-tacky on both sides for easy re-positioning, ease of use and assembly error reduction
Superior breakdown voltage and surface wet out values
Designed for applications where
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