Bergquist TSP 1800 Series Self-Adhesive Thermal Interface Pad, 0.009 in Thick, 1.8 W/mK, 12 in, 12in, Silicone

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₩99,922.00

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  • 2026년 11월 13일 부터 배송
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RS 제품 번호:
282-6864
제조사 부품 번호:
SIL PAD TSP 1800, 12in x 12in x 0.009
제조업체:
Bergquist
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모두 선택

브랜드

Bergquist

Product Type

Thermal Interface Pad

Thickness

0.009in

Thermal Conductivity

1.8W/mK

Self-Adhesive

Yes

Trade Name

TSP 1800

Conductive Material

Silicone

Width

12in

Standards/Approvals

No

Length

12in

Series

TSP 1800

제외

COO (Country of Origin):
US
The Bergquist silicone based fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use as well as an optional adhesive coating. It exhibits exceptional thermal performance at low and high application pressures. The material is ideal for placement between electronic power devices and a heat sink for screw and clip mounted applications.

Exceptional thermal performance at lower application pressures

Smooth and non-tacky on both sides for easy re-positioning, ease of use and assembly error reduction

Superior breakdown voltage and surface wet out values

Designed for applications where

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