Alliance Memory NAND 5 GB Flash Memory FBGA, ASFC5G31P3-51BIN
- RS 제품 번호:
- 338-521
- 제조사 부품 번호:
- ASFC5G31P3-51BIN
- 제조업체:
- Alliance Memory
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이 품목의 재입고 여부는 알 수 없으며 제조업체에서 단종되고 있습니다.
- RS 제품 번호:
- 338-521
- 제조사 부품 번호:
- ASFC5G31P3-51BIN
- 제조업체:
- Alliance Memory
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Alliance Memory | |
| Product Type | Flash Memory | |
| Memory Size | 5GB | |
| Package Type | FBGA | |
| Maximum Clock Frequency | 200MHz | |
| Cell Type | NAND | |
| Maximum Supply Voltage | 3.6V | |
| Minimum Supply Voltage | 2.7V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Width | 11.5mm | |
| Standards/Approvals | RoHS Compliant | |
| Height | 1mm | |
| Length | 13mm | |
| Series | ASFC 3D pSLC | |
| Automotive Standard | No | |
| Supply Current | 132mA | |
| 모두 선택 | ||
|---|---|---|
브랜드 Alliance Memory | ||
Product Type Flash Memory | ||
Memory Size 5GB | ||
Package Type FBGA | ||
Maximum Clock Frequency 200MHz | ||
Cell Type NAND | ||
Maximum Supply Voltage 3.6V | ||
Minimum Supply Voltage 2.7V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Width 11.5mm | ||
Standards/Approvals RoHS Compliant | ||
Height 1mm | ||
Length 13mm | ||
Series ASFC 3D pSLC | ||
Automotive Standard No | ||
Supply Current 132mA | ||
- COO (Country of Origin):
- DE
The Alliance Memory e-MMC is a managed non-volatile storage consisting of a single chip MMC controller and a NAND flash memory chip inside a JEDEC defined standard BGA package. It is specially designed as a small form factor memory product for storage of data and as a boot media. The performance is optimized to a mostly read operation mode at low power consumption. The utilization of 3D pSLC NAND technology targets higher demanding and write intensive industrial applications, which is supported by the industrial temperature grade specification. The e-MMC controller directly manages NAND flash, including ECC, wear-leveling, IOPS optimization and read sensing. The 3D PSLC firmware features support high throughput for large data transfers and performance for small random data more commonly found in code usage. It also contains several security features as well as multiple boot partitions. Uses advanced refresh features for retention optimization for read intensive applications.
Capacities 5G
Fully compliant with JEDEC eMMC 5.1 Standard JESD84-B51
153-ball BGA 0.5mm pitch 11.5 x 13mm RoHS compliant
3D TLC NAND base technology in Enhanced Mode pSLC
관련된 링크들
- Alliance Memory NAND 10 GB Flash Memory FBGA, ASFC10G31P3-51BIN
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- Alliance Memory NAND 8 GB EMMC eMMC Device 153-Pin FBGA, ASFC8G31M-51BIN
- Alliance Memory NAND 64000 MB EMMC Flash Memory 153-Pin FBGA, ASFC64G31T5-51BIN
- Alliance Memory NAND 32000 MB EMMC Flash Memory 153-Pin FBGA, ASFC32G31T3-51BIN
- Alliance Memory NAND 4 GB EMMC Flash Memory 153-Pin FBGA
- Alliance Memory NAND 16 GB EMMC Flash Memory 153-Pin FBGA
