Alliance Memory NAND 64000 MB EMMC Flash Memory 153-Pin FBGA, ASFC64G31T5-51BIN
- RS 제품 번호:
- 665-371
- 제조사 부품 번호:
- ASFC64G31T5-51BIN
- 제조업체:
- Alliance Memory
Subtotal (1 unit)*
₩32,242.00
재고있음
- 146 개 단위 배송 준비 완료
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수량 | 한팩당 |
|---|---|
| 1 + | ₩32,242.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 665-371
- 제조사 부품 번호:
- ASFC64G31T5-51BIN
- 제조업체:
- Alliance Memory
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Alliance Memory | |
| Memory Size | 64000MB | |
| Product Type | Flash Memory | |
| Interface Type | EMMC | |
| Package Type | FBGA | |
| Pin Count | 153 | |
| Organisation | 64G x 8 | |
| Maximum Clock Frequency | 200MHz | |
| Cell Type | NAND | |
| Minimum Supply Voltage | 1.7V | |
| Maximum Supply Voltage | 3.6V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | JEDEC e·MMC 5.1 (JESD84-B51), RoHS | |
| Length | 13mm | |
| Width | 11.5 mm | |
| Height | 1.2mm | |
| Series | ASFC | |
| Number of Bits per Word | 8 | |
| Automotive Standard | No | |
| Supply Current | 0.06mA | |
| 모두 선택 | ||
|---|---|---|
브랜드 Alliance Memory | ||
Memory Size 64000MB | ||
Product Type Flash Memory | ||
Interface Type EMMC | ||
Package Type FBGA | ||
Pin Count 153 | ||
Organisation 64G x 8 | ||
Maximum Clock Frequency 200MHz | ||
Cell Type NAND | ||
Minimum Supply Voltage 1.7V | ||
Maximum Supply Voltage 3.6V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals JEDEC e·MMC 5.1 (JESD84-B51), RoHS | ||
Length 13mm | ||
Width 11.5 mm | ||
Height 1.2mm | ||
Series ASFC | ||
Number of Bits per Word 8 | ||
Automotive Standard No | ||
Supply Current 0.06mA | ||
- COO (Country of Origin):
- DE
The Alliance Memory 64GB eMMC in a 153-ball FBGA package is a managed non-volatile storage device consisting of an integrated MMC controller and NAND flash memory within a JEDEC-defined standard BGA package. It is specifically designed as a compact memory solution for data storage and boot media. Optimized for predominantly read operations with low power consumption, it utilizes 3D TLC NAND technology and offers an optional Enhanced mode (pSLC) configuration to meet higher industrial performance demands. The device also supports industrial temperature grade specifications
3D TLC NAND base technology
Boot Operation Mode and Alternative Boot Operation Mode
Replay Protected Memory Block (RPMB)
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