Bergquist 6000UL Series Self-Adhesive Thermal Gap Pad, 0.125 in Thick, 6 W/mK, 16 in, 8in, Silicone
- RS 제품 번호:
- 282-6792
- 제조사 부품 번호:
- GAP PAD TGP 6000ULM, 16in x 8in x 0.125 sh
- 제조업체:
- Bergquist
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- RS 제품 번호:
- 282-6792
- 제조사 부품 번호:
- GAP PAD TGP 6000ULM, 16in x 8in x 0.125 sh
- 제조업체:
- Bergquist
사양
참조 문서
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제품 세부 사항
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.125in | |
| Thermal Conductivity | 6W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Silicone | |
| Standards/Approvals | No | |
| Length | 16in | |
| Width | 8in | |
| Series | 6000UL | |
| 모두 선택 | ||
|---|---|---|
브랜드 Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.125in | ||
Thermal Conductivity 6W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Silicone | ||
Standards/Approvals No | ||
Length 16in | ||
Width 8in | ||
Series 6000UL | ||
제외
- COO (Country of Origin):
- US
The Bergquist is an extremely soft gap filling material rated at a thermal conductivity of 6.0 W per mK. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. It is highly conformal, even to surfaces with high roughness or topography, allowing for excellent interfacing and wet-out characteristics.
High-compliance
Low compression stress
Ultra low modulus
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