Bergquist 6000UL Series Self-Adhesive Thermal Gap Pad, 0.1 in Thick, 6 W/mK, 16 in, 8in, Silicone
- RS 제품 번호:
- 282-6791
- 제조사 부품 번호:
- GAP PAD TGP 6000ULM, 16in x 8in x 0.1 sh
- 제조업체:
- Bergquist
Subtotal (1 unit)*
₩936,343.20
일시적 품절
- 2026년 7월 13일 부터 배송
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수량 | 한팩당 |
|---|---|
| 1 + | ₩936,343.20 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 282-6791
- 제조사 부품 번호:
- GAP PAD TGP 6000ULM, 16in x 8in x 0.1 sh
- 제조업체:
- Bergquist
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.1in | |
| Thermal Conductivity | 6W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Silicone | |
| Length | 16in | |
| Standards/Approvals | No | |
| Width | 8in | |
| Series | 6000UL | |
| 모두 선택 | ||
|---|---|---|
브랜드 Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.1in | ||
Thermal Conductivity 6W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Silicone | ||
Length 16in | ||
Standards/Approvals No | ||
Width 8in | ||
Series 6000UL | ||
제외
- COO (Country of Origin):
- US
The Bergquist is an extremely soft gap filling material rated at a thermal conductivity of 6.0 W per mK. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. It is highly conformal, even to surfaces with high roughness or topography, allowing for excellent interfacing and wet-out characteristics.
High-compliance
Low compression stress
Ultra low modulus
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