Metcal SSC 2.5 mm Chisel 9.9 mm Soldering Iron Tip for use with MFR-H6-SSC, SP-HC1

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₩45,160.00

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RS 제품 번호:
121-747
제조사 부품 번호:
SSC-736A
제조업체:
Metcal
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모두 선택

브랜드

Metcal

Product Type

Soldering Iron Tip

Tip Shape

Chisel

Model Number

SSC

For Use With

MFR-H6-SSC, SP-HC1

Tip Series

SSC

Tip Angle

30°

Tip Width

2.5 mm

Tip Length

9.9mm

Standards/Approvals

RoHS

COO (Country of Origin):
US

Metcal Soldering Iron Tip, 9.9mm Length, 2.5mm Width - SSC-736A


This soldering iron tip is designed for precision soldering tasks in Electronic Assembly and repair, providing a chisel profile suited to controlled heat transfer and accurate solder application. It is intended for use with compatible handheld soldering irons and supports fine-detail work where a defined edge and consistent contact are required.

Features and Benefits:


• Chisel-shaped edge delivers accurate solder placement and bead control
• 30° tip angle aids access to crowded component areas
• RoHS-compliant construction reduces hazardous substances exposure
• Short 9.9mm length improves thermal response and tip control
• 2.5mm width offers a balance between surface contact and precision

Applications


• Used for component leads on densely populated PCB work
• Suitable for fine rework and small joint repair operations
• Can be used for precision chisel tip soldering in electronics
• Compatible replacement tip for SP-HC1 hand tools

Which tool interfaces are compatible with this tip?


It fits specified handheld iron types and can be mounted on compatible chisel-tip holders.

How does the tip geometry affect thermal behaviour?


The short length and chisel profile reduce thermal mass, enabling Faster heat-up and recovery during intermittent soldering.

What operational advantage does the 30° angle provide?


The angled bevel improves access to side-facing pads and tight component spacing without repositioning the workpiece.

How does the 2.5mm width influence solder joint formation?


The moderate contact area allows sufficient heat transfer for reliable joints while maintaining fine control over solder distribution.

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