Infineon HEXFET Type N-Channel MOSFET, 3.4 A, 30 V Enhancement, 3-Pin SOT-23

본 이미지는 참조용이오니 재확인이 필요하시면 문의해주세요.

대량 구매 할인 기용 가능
View bulk pricing options

Subtotal (1 reel of 3000 units)*

₩480,000.00

Add to Basket
수량 선택 또는 입력
일시적 품절
  • 2026년 10월 15일 부터 3,000 개 단위 배송
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.

수량
한팩당
릴당*
3000 - 12000₩160.00₩477,600.00
15000 +₩156.00₩468,000.00

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
913-4070
제조사 부품 번호:
IRLML6346TRPBF
제조업체:
Infineon
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

3.4A

Maximum Drain Source Voltage Vds

30V

Series

HEXFET

Package Type

SOT-23

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

80mΩ

Channel Mode

Enhancement

Forward Voltage Vf

1.2V

Maximum Power Dissipation Pd

1.3W

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

2.9nC

Maximum Operating Temperature

150°C

Standards/Approvals

No

Height

1.02mm

Length

3.04mm

Automotive Standard

No

COO (Country of Origin):
PH

Infineon HEXFET Series MOSFET, 30V Maximum Drain Source Voltage, 3.4A Maximum Continuous Drain Current - IRLML6346TRPBF


This MOSFET is a compact N-channel enhancement-mode transistor designed for surface-mount power switching and management in compact electronic assemblies. It operates across a wide ambient range and is intended for low-voltage DC switching tasks where efficient conduction and modest power dissipation are required.

Features and Benefits:


• Low conduction resistance of 80mΩ enabling reduced I2R losses
• Continuous drain current rating of 3.4A allowing moderate load handling
• Drain‑source voltage capability of 30V for low-voltage power rails
• Gate charge of 2.9nC supporting fast gate transitions
• Gate withstand of 12V permitting standard drive voltages
• Maximum power dissipation 1.3W supporting sustained switching

Applications


• Suitable for DC-DC converter switching stages
• Ideal for battery management and power-rail control
• Used with motor-driver gate stages in compact devices
• Can be used for load-switching in portable electronics
• Appropriate for general-purpose power management on SMD boards

What thermal limits should be considered in design?


The device functions from -55°C up to 150°C, so thermal planning must account for ambient plus junction rise and ensure adequate PCB copper or heatsinking to maintain junction temperatures within that range.

How does the package type affect assembly and layout?


The SOT-23 surface-mount package requires minimal board space and standard pick-and-place processes

layout should include short thermal and current traces to exploit conduction performance.

What switching behaviour can be expected during fast transitions?


With a typical gate charge of 2.9nC, gate driver sizing should match desired rise/fall times to balance switching losses and EMI for fast-edge applications.

Are there constraints on gate drive voltage?


The gate may be driven up to 12V maximum

designs should limit gate amplitude to avoid exceeding this rating while ensuring reliable enhancement.

관련된 링크들