Infineon HEXFET Type P-Channel MOSFET, 3 A, 30 V Enhancement, 3-Pin SOT-23

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₩428,640.00

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3000 - 12000₩142.88₩430,332.00
15000 +₩141.00₩421,872.00

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RS 제품 번호:
913-4705
제조사 부품 번호:
IRLML5203TRPBF
제조업체:
Infineon
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브랜드

Infineon

Product Type

MOSFET

Channel Type

Type P

Maximum Continuous Drain Current Id

3A

Maximum Drain Source Voltage Vds

30V

Package Type

SOT-23

Series

HEXFET

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

165mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Maximum Gate Source Voltage Vgs

20 V

Maximum Power Dissipation Pd

1.25W

Forward Voltage Vf

-1.2V

Typical Gate Charge Qg @ Vgs

9.5nC

Maximum Operating Temperature

150°C

Width

1.4 mm

Length

3.04mm

Standards/Approvals

No

Height

1.02mm

Automotive Standard

No

COO (Country of Origin):
MX

Infineon HEXFET Series MOSFET, 3A Maximum Continuous Drain Current, 30V Maximum Drain Source Voltage - IRLML5203TRPBF


This MOSFET is a high-performance power device suitable for a range of applications in the electronics sector. Featuring a compact SOT-23 package, this P-channel device provides significant efficiency with a maximum continuous drain current of 3A and a drain-source voltage of 30V. With dimensions of 3.04mm in length, 1.4mm in width, and 1.02mm in height, it is well-suited for space-constrained designs.

Features & Benefits


• Capable of 30V drain-source voltage for versatile use

• Designed for surface mount for simplified PCB design

• Operates within a temperature range of -55°C to +150°C

• Utilises enhancement mode for reliable switching performance

Applications


• Utilised in battery management systems for optimal performance

• Used in portable electronics due to low-profile design

• Applied in load management solutions across various devices

• Suitable for advanced automation control systems

What is the significance of the low Rds(on) in this device?


The low Rds(on) ensures reduced power loss during operation, which enhances overall efficiency and maintains lower thermal levels in applications.

How does the power dissipation capability impact device performance?


The capability to dissipate up to 1.25W allows for effective heat management, ensuring the device operates reliably even under maximum load conditions without thermal failure.

What factors influence the selection of this MOSFET for a specific application?


Factors such as maximum continuous drain current, voltage ratings, and thermal characteristics should be considered to ensure compatibility with circuit requirements and performance expectations.

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