Infineon HEXFET Type N-Channel MOSFET, 6.3 A, 20 V Enhancement, 3-Pin SOT-23 IRLML6244TRPBF

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포장 옵션
RS 제품 번호:
737-7228
Distrelec 제품 번호:
304-45-316
제조사 부품 번호:
IRLML6244TRPBF
제조업체:
Infineon
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모두 선택

브랜드

Infineon

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

6.3A

Maximum Drain Source Voltage Vds

20V

Package Type

SOT-23

Series

HEXFET

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

27mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

8.9nC

Maximum Power Dissipation Pd

1.3W

Forward Voltage Vf

1.2V

Maximum Operating Temperature

150°C

Length

3.04mm

Height

1.02mm

Standards/Approvals

No

Automotive Standard

No

Infineon HEXFET Series MOSFET, 20V Maximum Drain Source Voltage, 6.3A Maximum Continuous Drain Current - IRLML6244TRPBF


This MOSFET is a low-voltage switching transistor designed for surface-mount applications where compact power handling is required. It functions as an N-channel enhancement device suitable for power-management roles in densely populated electronic assemblies. The component operates across a wide temperature range and tolerates standard gate-drive excursions, making it appropriate for high-efficiency DC-DC conversion and general switching duties.

Features and Benefits:


• Very low on-resistance 27mΩ reduces conduction losses
• Continuous drain current 6.3A supports higher load currents
• Drain-source voltage rating 20V enables low-voltage power designs
• Maximum power dissipation 1.3W allows sustained thermal loading
• Gate charge 8.9nC enables efficient switching performance
• Gate-source tolerance 12V permits robust drive margin

Applications


• Suitable for DC-DC converter stages in compact electronics
• Ideal for battery management and portable power circuits
• Used with switching regulators in telecom equipment
• Can be used for load switching in small motor drivers
• Useful for power path control in consumer devices

What temperature extremes can it withstand in operation?


It is rated for operation from -55°C up to 150°C, allowing use in harsh thermal environments.

How does package choice affect thermal and assembly considerations?


The SOT-23 surface-mount package minimises board footprint and supports automated placement while limiting thermal conduction compared with larger packages.

What pin configuration is available for PCB layout?


The device presents a three-pin arrangement compatible with standard SOT-23 land patterns for straightforward routing.

How does channel behaviour influence design topology?


As an N-channel enhancement device, it requires a positive gate drive relative to source to switch and is suited to low-side switching or synchronous rectification roles.

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