Infineon 700V CoolMOS P7 Type N-Channel MOSFET, 12.5 A, 700 V Enhancement, 3-Pin TO-252

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  • 2027년 2월 04일 부터 배송
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RS 제품 번호:
214-4391
제조사 부품 번호:
IPD70R360P7SAUMA1
제조업체:
Infineon
제품 정보를 선택해 유사 제품을 찾기
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브랜드

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

12.5A

Maximum Drain Source Voltage Vds

700V

Package Type

TO-252

Series

700V CoolMOS P7

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

360mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-40°C

Maximum Power Dissipation Pd

59.5W

Forward Voltage Vf

0.9V

Typical Gate Charge Qg @ Vgs

16.4nC

Maximum Operating Temperature

150°C

Height

2.35mm

Standards/Approvals

No

Length

6.65mm

Automotive Standard

No

Infineon 700V CoolMOS P7 Series MOSFET, 700V Drain Source Voltage, 12.5A Continuous Drain Current - IPD70R360P7SAUMA1


This MOSFET is a high-voltage N-channel enhancement device designed for switch-mode power conversion and other power-handling roles. It is a surface-mount component intended for use where robust voltage blocking and switching capability are needed in compact assemblies. The device operates across a wide temperature range and supports typical gate-drive voltages for power electronics applications.

Features and Benefits:


• 700V blocking capability enables high-voltage designs
• 12.5A continuous drain current supports substantial load currents
• RDS(on) 360mΩ minimises conduction losses under load
• Power dissipation 59.5W allows sustained thermal handling
• Gate charge 16.4nC reduces switching energy losses
• VGS rating ±16V permits standard gate-drive margins

Applications


• Suitable for high-voltage SMPS primary switches
• Ideal for industrial power converter stages
• Used with flyback and forward topologies in supplies
• Can be used for power-factor-correction front ends
• Appropriate for high-voltage testing and lab setups

What thermal range can the device tolerate in operation?


It is specified to operate from -40°C up to 150°C, allowing use in demanding thermal environments.

What package should I expect for board layout considerations?


The part is supplied in a TO-252 surface-mount package with three pins for straightforward PCB footprint integration.

What is the forward conduction characteristic under switching?


The forward voltage is 0.9V which influences conduction-loss calculations during on-state operation.

How should gate-drive design account for switching behaviour?


Use the typical gate charge of 16.4nC to size driver current and switching timing for desired transition speeds.

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