Vishay SI8802DB Type N-Channel MOSFET, 3.5 A, 8 V Enhancement, 4-Pin MICRO FOOT SI8802DB-T2-E1

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포장 옵션
RS 제품 번호:
180-7724
제조사 부품 번호:
SI8802DB-T2-E1
제조업체:
Vishay
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모두 선택

브랜드

Vishay

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

3.5A

Maximum Drain Source Voltage Vds

8V

Package Type

MICRO FOOT

Series

SI8802DB

Mount Type

Surface

Pin Count

4

Maximum Drain Source Resistance Rds

54mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

0.6W

Typical Gate Charge Qg @ Vgs

4.3nC

Maximum Gate Source Voltage Vgs

5V

Forward Voltage Vf

1.2V

Maximum Operating Temperature

150°C

Length

0.8mm

Standards/Approvals

RoHS

Width

0.8mm

Automotive Standard

No

Vishay SI8802DB Series MOSFET, 3.5A Maximum Continuous Drain Current, 8V Maximum Drain Source Voltage - SI8802DB-T2-E1


This n-channel enhancement MOSFET is designed for low-voltage switching and power-management tasks in compact surface-mount assemblies. It operates across a wide temperature range and is suited to designs requiring a small footprint and moderate continuous current capability. The device conforms to RoHS requirements and is supplied in a very compact micro package for high-density board layouts.

Features and Benefits:


• 54mΩ on-resistance reduces conduction losses and heat generation
• 8V drain-source rating enables low-voltage power stages
• 3.5A continuous drain current supports moderate load currents
• 4.3nC typical gate charge permits faster switching transitions
• 0.6W maximum power dissipation limits thermal stress under load
• -55°C to 150°C operating temperature range ensures wide thermal tolerance

Applications


• Suitable for battery-powered low-voltage DC power switching
• Ideal for compact power-management modules on small PCBs
• Used with motor-driver stages requiring fast switching
• Can be used for portable device power-rail switching
• Used for load switching in dense surface-mount assemblies

What pin count and mounting style does it use?


It is supplied as a four-pin device intended for surface-mount assembly in a micro-footprint package.

How does its thermal performance constrain PCB design?


With a 0.6W maximum dissipation and a small package, adequate copper area or thermal vias are recommended to spread heat and prevent localised temperature rise.

What gating considerations are advised for fast switching?


The typical gate charge of 4.3nC at the specified gate voltage necessitates driver stages capable of sourcing and sinking sufficient current to achieve the desired edge rates.

What voltage limits must be respected for safe operation?


The device must not exceed an 8V drain-source differential and a 5V gate-source amplitude to remain within specified electrical limits.

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