Infineon IKW50N65F5FKSA1 IGBT Module, 80 A 650 V, 3-Pin PG-TO-247

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Subtotal (1 tube of 30 units)*

₩143,580.00

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  • 2027년 6월 03일 부터 240 개 단위 배송
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30 +₩4,786.00₩143,598.00

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RS 제품 번호:
259-1532
제조사 부품 번호:
IKW50N65F5FKSA1
제조업체:
Infineon
제품 정보를 선택해 유사 제품을 찾기
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브랜드

Infineon

Maximum Continuous Collector Current Ic

80A

Product Type

IGBT Module

Maximum Collector Emitter Voltage Vceo

650V

Maximum Power Dissipation Pd

305W

Package Type

PG-TO-247

Pin Count

3

Maximum Collector Emitter Saturation Voltage VceSAT

1.6V

Minimum Operating Temperature

-40°C

Maximum Gate Emitter Voltage VGEO

±20 ±30 V

Maximum Operating Temperature

175°C

Series

IKW

Standards/Approvals

JEDEC, RoHS

Length

41.42mm

Width

16.13mm

Automotive Standard

No

Infineon IKW Series IGBT Module, 80A Maximum Continuous Collector Current, 305W Maximum Power Dissipation - IKW50N65F5FKSA1


This IGBT module is a power semiconductor designed for high-voltage switching in industrial converters and inverters. It combines a high gate-emitter voltage rating with elevated thermal tolerance to operate across a wide temperature range, making it suitable for demanding electrical power stages where sustained current handling and heat management are required.

Features and Benefits:


• 80A current rating for sustained high-load operation
• 650V gate-emitter withstand for robust voltage margins
• 305W dissipation enabling elevated power handling
• VceSAT 1.6V ensuring efficient conduction under load
• 3-pin package for straightforward connectivity and control

Applications


• Suitable for use in power converters and inverters
• Ideal for industrial motor drive modules
• Used with high-voltage DC link switching stages
• Can be used for power supply front-end switch devices

What temperature extremes can it tolerate?


It operates from -40°C up to 175°C allowing use in wide ambient ranges.

What package size and pin count does it use?


The component comes in a PG-TO-247 package with three connection pins.

Which compliance standards are met for industry integration?


It conforms to JEDEC specifications and meets RoHS environmental restrictions.

How Compact is the module for PCB or heatsink layout?


Its overall footprint measures 16.13mm width by 41.42mm length facilitating dense arrangements.

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