Infineon 16 kB SPI FRAM 8-Pin SOIC, FM25L16B-G

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₩13,360.00

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5 - 20₩2,672.00₩13,360.00
25 - 45₩2,616.00₩13,080.00
50 +₩2,556.00₩12,780.00

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포장 옵션
RS 제품 번호:
125-4226
제조사 부품 번호:
FM25L16B-G
제조업체:
Infineon
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브랜드

Infineon

Product Type

FRAM

Memory Size

16kB

Organisation

2K x 8 bit

Interface Type

SPI

Data Bus Width

8bit

Maximum Random Access Time

20ns

Mount Type

Surface

Maximum Clock Frequency

20MHz

Package Type

SOIC

Pin Count

8

Height

1.48mm

Length

4.97mm

Width

3.98mm

Standards/Approvals

No

Maximum Operating Temperature

85°C

Minimum Supply Voltage

2.7V

Automotive Standard

AEC-Q100

Number of Words

2k

Minimum Operating Temperature

-40°C

Number of Bits per Word

8

Maximum Supply Voltage

3.6V

Infineon FRAM, 16kB Memory Size, 3.6V Maximum Supply Voltage - FM25L16B-G


This FRAM is a non-volatile memory device intended for serial-interface data storage in constrained electronic systems. It operates from a low-voltage supply and communicates via a serial peripheral interface, making it suitable for applications requiring rapid writes and frequent data updates in embedded and automotive environments.

Features and Benefits:


• 16 kB storage capacity enables frequent data logging
• 20 ns random access time supports rapid read operations
• 20 MHz clock rate allows fast SPI transfers
• 8-bit data bus simplifies byte-oriented interfacing
• AEC‑Q100 grading facilitates automotive system integration
• 2.7 V-3.6V operating range reduces power-supply complexity

Applications


• Suitable for automotive sensor configuration retention
• Used with microcontrollers for run-time parameter storage
• Ideal for recorder modules needing frequent writes
• Can be used for energy-harvesting data buffers
• Appropriate for industrial control non-volatile logging

What package and mounting style does it use?


It is supplied in an 8-pin SOIC package designed for surface-mount assembly on PCBs.

What environmental temperature range is supported?


It functions across an industrial temperature span from -40°C to 85°C for wide-ranging ambient conditions.

How is memory organised for software addressing?


The array is arranged as 2K words of 8 bits, allowing byte-addressable access across 2k locations.

What are the physical envelope dimensions for layout planning?


The package measures 4.97mm in length and 3.98mm in width with a maximum height of 1.48 mm.

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