Vishay Synchronous Buck Regulator, 20 A Output Current, 15 Outputs

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Subtotal (1 tray of 210 units)*

₩4,300,800.00

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  • 2027년 1월 25일 부터 배송
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Per Tray*
210 - 210₩20,480.00₩4,300,632.00
420 +₩19,456.00₩4,085,592.00

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
274-8642
제조사 부품 번호:
SIC931BED-Y1-GE3
제조업체:
Vishay
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모두 선택

브랜드

Vishay

Product Type

Synchronous Buck Regulator

Output Current

20A

Number of Outputs

15

Efficiency

95%

Maximum Operating Temperature

125°C

Minimum Operating Temperature

-40°C

Series

SiC931

Number of Pins

63

Package Type

PowerPAK MLP60-A6C

Width

6.5mm

Length

10.6mm

Standards/Approvals

RoHS

Maximum Input Voltage

18V

Minimum Input Voltage

4.5V

COO (Country of Origin):
TW

Vishay SiC931 Series Synchronous Buck Regulator, 20A Output Current, 95% Efficiency - SIC931BED-Y1-GE3


This synchronous buck regulator converts higher DC voltages into regulated lower outputs for multi-rail power systems. It is designed for compact board-level installation and supports demanding thermal environments, making it suitable for industrial and automotive contexts where multiple regulated outputs are required.

Features and Benefits:


• 95% peak conversion efficiency reduces system heat
• Operates from 4.5V to 18V input for flexible supply ranges
• Delivers 20A output current to support high-load rails
• RoHS-compliant construction supports environmental regulations
• Withstands up to 125°C for elevated temperature operation
• Provides 15 independent outputs for complex power distribution

Applications


• Suitable for vehicle control units requiring elevated temperature tolerance
• Ideal for industrial control systems with multi-rail requirements
• Used with point-of-load arrangements in telecoms equipment
• Can be used for power distribution in embedded computing platforms
• Suitable for battery-powered systems needing broad input range

How many electrical connections are available for board routing?


The module exposes 63 pins to facilitate multiple signal, power and earth/ground connections for complex layouts.

What package format assists high-density PCB placement?


It uses a PowerPAK MLP60-A6C package that supports compact solder-down mounting for space-constrained designs.

What thermal limits should PCB designers consider?


The device is specified to operate up to 125°C, so designers should plan thermal vias and adequate copper pour to manage dissipation.

What are the physical envelope considerations for enclosure design?


The component footprint measures 10.6mm by 6.5mm, enabling tight placement while allowing for standard clearance and cooling strategies.

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