Vishay, 14 Outputs Synchronous Buck Regulator, 25 A Output Current
- RS 제품 번호:
- 274-8648
- 제조사 부품 번호:
- SIC951ED-Y1-GE3
- 제조업체:
- Vishay
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대량 구매 할인 기용 가능
View bulk pricing optionsSubtotal (1 unit)*
₩36,520.00
재고있음
- 191 개 단위 배송 준비 완료
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수량 | 한팩당 |
|---|---|
| 1 - 4 | ₩36,520.00 |
| 5 - 9 | ₩34,180.00 |
| 10 - 24 | ₩32,980.00 |
| 25 - 99 | ₩31,800.00 |
| 100 + | ₩28,280.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 274-8648
- 제조사 부품 번호:
- SIC951ED-Y1-GE3
- 제조업체:
- Vishay
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Vishay | |
| Product Type | Synchronous Buck Regulator | |
| Output Current | 25A | |
| Number of Outputs | 14 | |
| Efficiency | 97% | |
| Maximum Operating Temperature | 125°C | |
| Minimum Operating Temperature | -40°C | |
| Series | SiC951 | |
| Number of Pins | 63 | |
| Package Type | PowerPAK MLP60-A6C | |
| Standards/Approvals | RoHS | |
| Length | 10.6mm | |
| Width | 6.5mm | |
| Maximum Input Voltage | 20V | |
| Minimum Input Voltage | 4.5V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Vishay | ||
Product Type Synchronous Buck Regulator | ||
Output Current 25A | ||
Number of Outputs 14 | ||
Efficiency 97% | ||
Maximum Operating Temperature 125°C | ||
Minimum Operating Temperature -40°C | ||
Series SiC951 | ||
Number of Pins 63 | ||
Package Type PowerPAK MLP60-A6C | ||
Standards/Approvals RoHS | ||
Length 10.6mm | ||
Width 6.5mm | ||
Maximum Input Voltage 20V | ||
Minimum Input Voltage 4.5V | ||
- COO (Country of Origin):
- TW
Vishay SiC951 Series Synchronous Buck Regulator, 25A Output Current, 4.5V Minimum Input Voltage - SIC951ED-Y1-GE3
This synchronous buck regulator converts higher DC voltages down to regulated low-voltage rails for power-dense systems. It is intended for compact, high-current power management in electronics where efficient step-down conversion and thermal tolerance are required. The device operates across a broad input range and is suited to environments demanding sustained performance at elevated temperatures.
Features and Benefits:
• 97% efficiency reduces power dissipation and heat generation
• 25A continuous output supports high-current load demands
• 4.5-20V input range enables flexible supply configurations
• 63-pin package allows complex routing and multi-signal integration
• RoHS conformity facilitates environmentally constrained designs
• -40°C to 125°C rating supports wide thermal operating envelopes
• 25A continuous output supports high-current load demands
• 4.5-20V input range enables flexible supply configurations
• 63-pin package allows complex routing and multi-signal integration
• RoHS conformity facilitates environmentally constrained designs
• -40°C to 125°C rating supports wide thermal operating envelopes
Applications
• Suitable for automotive power distribution modules requiring high current
• Ideal for industrial control systems with wide temperature ranges
• Used with multi-rail computing boards needing compact regulators
• Can be used for high-density telecommunications power supplies
• Appropriate for test and measurement equipment requiring efficient step-down conversion
• Ideal for industrial control systems with wide temperature ranges
• Used with multi-rail computing boards needing compact regulators
• Can be used for high-density telecommunications power supplies
• Appropriate for test and measurement equipment requiring efficient step-down conversion
What physical package does it use and why does that matter?
It is supplied in a low-profile PowerPAK MLP60-A6C package which aids PCB real-estate savings and improves thermal conduction to the board.
How does the unit cope with thermal stress during sustained loads?
The maximum operating temperature of 125°C allows it to remain functional under elevated junction conditions when paired with adequate PCB thermal management.
What pin capacity is available for integration and control?
There are 63 pins providing ample connections for power, control and monitoring interfaces to support complex application requirements.
What mounting footprint should designers expect for compact systems?
The module measures 10.6x6.5mm, enabling integration into space-constrained layouts without compromising current capability.
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