Infineon HEXFET N-Channel MOSFET, 12 A, 60 V Enhancement, 8-Pin SOIC IRF7855TRPBF
- RS 제품 번호:
- 827-3893
- 제조사 부품 번호:
- IRF7855TRPBF
- 제조업체:
- Infineon
Subtotal (1 pack of 10 units)*
₩22,320.00
재고있음
- 추가로 2026년 10월 05일 부터 7,230 개 단위 배송
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수량 | 한팩당 | 한팩당* |
|---|---|---|
| 10 + | ₩2,232.00 | ₩22,320.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 827-3893
- 제조사 부품 번호:
- IRF7855TRPBF
- 제조업체:
- Infineon
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Infineon | |
| Product Type | MOSFET | |
| Channel Type | N | |
| Maximum Continuous Drain Current Id | 12A | |
| Maximum Drain Source Voltage Vds | 60V | |
| Package Type | SOIC | |
| Series | HEXFET | |
| Mount Type | Surface | |
| Pin Count | 8 | |
| Maximum Drain Source Resistance Rds | 9.4mΩ | |
| Channel Mode | Enhancement | |
| Forward Voltage Vf | 1.3V | |
| Maximum Gate Source Voltage Vgs | -20V, +20V | |
| Typical Gate Charge Qg @ Vgs | 26nC | |
| Maximum Power Dissipation Pd | 2.5W | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 150°C | |
| Height | 1.5mm | |
| Length | 5mm | |
| Standards/Approvals | No | |
| Width | 4mm | |
| Automotive Standard | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Infineon | ||
Product Type MOSFET | ||
Channel Type N | ||
Maximum Continuous Drain Current Id 12A | ||
Maximum Drain Source Voltage Vds 60V | ||
Package Type SOIC | ||
Series HEXFET | ||
Mount Type Surface | ||
Pin Count 8 | ||
Maximum Drain Source Resistance Rds 9.4mΩ | ||
Channel Mode Enhancement | ||
Forward Voltage Vf 1.3V | ||
Maximum Gate Source Voltage Vgs -20V, +20V | ||
Typical Gate Charge Qg @ Vgs 26nC | ||
Maximum Power Dissipation Pd 2.5W | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 150°C | ||
Height 1.5mm | ||
Length 5mm | ||
Standards/Approvals No | ||
Width 4mm | ||
Automotive Standard No | ||
Infineon HEXFET Series MOSFET, 60V Maximum Drain Source Voltage, 12A Maximum Continuous Drain Current - IRF7855TRPBF
This MOSFET is a high-current N-channel transistor designed for switching and power-management tasks in surface-mounted assemblies. It operates across a wide temperature range for industrial use and is suited to applications requiring low conduction losses and fast gate response. The device is supplied in an 8-pin SOIC package for compact PCB mounting and supports moderate power dissipation in continuous operation.
Features and Benefits:
• 60V drain rating enables switching in medium-voltage systems
• 12A continuous drain current supports elevated load currents
• 9.4mΩ low Rds(on) reduces conduction losses under load
• 26nC typical gate charge ensures responsive switching control
• 20V gate tolerance allows flexible drive voltages
• 2.5W power dissipation manages thermal load in confined spaces
• 12A continuous drain current supports elevated load currents
• 9.4mΩ low Rds(on) reduces conduction losses under load
• 26nC typical gate charge ensures responsive switching control
• 20V gate tolerance allows flexible drive voltages
• 2.5W power dissipation manages thermal load in confined spaces
Applications
• Suitable for power rails in industrial control equipment
• Used with motor drivers requiring high-current switching
• Ideal for DC-DC converters in compact power supplies
• Can be used for load switching in telecoms equipment
• Suitable for surface-mount designs requiring SOIC packages
• Used with motor drivers requiring high-current switching
• Ideal for DC-DC converters in compact power supplies
• Can be used for load switching in telecoms equipment
• Suitable for surface-mount designs requiring SOIC packages
What temperature range can it reliably withstand in operation?
It operates from -55°C up to 150°C, accommodating harsh industrial thermal environments.
How does the package type affect PCB layout considerations?
The 8-pin SOIC footprint requires attention to thermal vias and copper area to dissipate its 2.5W maximum power loss effectively.
What electrical characteristic determines conduction efficiency at high currents?
The devices maximum drain-source resistance of 9.4mΩ primarily governs conduction losses during sustained current flow.
How should gate drive be dimensioned for efficient switching?
Design gate drivers to supply sufficient charge for the typical 26nC Qg to balance switching speed against drive energy and EMI.
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