Infineon HEXFET Type N-Channel MOSFET, 12 A, 60 V Enhancement, 8-Pin SOIC

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RS 제품 번호:
165-5714
제조사 부품 번호:
IRF7855TRPBF
제조업체:
Infineon
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브랜드

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

12A

Maximum Drain Source Voltage Vds

60V

Package Type

SOIC

Series

HEXFET

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

9.4mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Forward Voltage Vf

1.3V

Typical Gate Charge Qg @ Vgs

26nC

Maximum Power Dissipation Pd

2.5W

Maximum Operating Temperature

150°C

Height

1.5mm

Standards/Approvals

No

Length

5mm

Automotive Standard

No

Infineon HEXFET Series MOSFET, 60V Maximum Drain Source Voltage, 12A Maximum Continuous Drain Current - IRF7855TRPBF


This MOSFET is a high-current N-channel transistor designed for switching and power-management tasks in surface-mounted assemblies. It operates across a wide temperature range for industrial use and is suited to applications requiring low conduction losses and fast gate response. The device is supplied in an 8-pin SOIC package for compact PCB mounting and supports moderate power dissipation in continuous operation.

Features and Benefits:


• 60V drain rating enables switching in medium-voltage systems
• 12A continuous drain current supports elevated load currents
• 9.4mΩ low Rds(on) reduces conduction losses under load
• 26nC typical gate charge ensures responsive switching control
• 20V gate tolerance allows flexible drive voltages
• 2.5W power dissipation manages thermal load in confined spaces

Applications


• Suitable for power rails in industrial control equipment
• Used with motor drivers requiring high-current switching
• Ideal for DC-DC converters in compact power supplies
• Can be used for load switching in telecoms equipment
• Suitable for surface-mount designs requiring SOIC packages

What temperature range can it reliably withstand in operation?


It operates from -55°C up to 150°C, accommodating harsh industrial thermal environments.

How does the package type affect PCB layout considerations?


The 8-pin SOIC footprint requires attention to thermal vias and copper area to dissipate its 2.5W maximum power loss effectively.

What electrical characteristic determines conduction efficiency at high currents?


The device’s maximum drain-source resistance of 9.4mΩ primarily governs conduction losses during sustained current flow.

How should gate drive be dimensioned for efficient switching?


Design gate drivers to supply sufficient charge for the typical 26nC Qg to balance switching speed against drive energy and EMI.

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