Vishay Si2309CDS Type P-Channel MOSFET, 1.2 A, -60 V Enhancement, 3-Pin SOT-23 SI2309CDS-T1-GE3

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포장 옵션
RS 제품 번호:
710-3250
제조사 부품 번호:
SI2309CDS-T1-GE3
제조업체:
Vishay
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모두 선택

브랜드

Vishay

Product Type

MOSFET

Channel Type

Type P

Maximum Continuous Drain Current Id

1.2A

Maximum Drain Source Voltage Vds

-60V

Package Type

SOT-23

Series

Si2309CDS

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

345mΩ

Channel Mode

Enhancement

Maximum Gate Source Voltage Vgs

20V

Typical Gate Charge Qg @ Vgs

2.7nC

Maximum Power Dissipation Pd

1.7W

Minimum Operating Temperature

-55°C

Forward Voltage Vf

-1.2V

Maximum Operating Temperature

150°C

Length

3.04mm

Standards/Approvals

RoHS

Width

1.4mm

Height

1.02mm

Automotive Standard

No

Vishay Si2309CDS Series MOSFET, -60V Drain Source Voltage, 1.2A Continuous Drain Current - SI2309CDS-T1-GE3


This p‑channel MOSFET is a surface‑mount transistor designed for switching and control tasks in Compact electronic assemblies. It operates as an enhancement‑mode device suitable for low‑ to medium‑current circuits, offering a balance of voltage handling and thermal endurance for industrial applications.

Features and Benefits:


• -60V maximum Vds for high‑voltage switching capability • 1.2A continuous drain current for moderate load handling • 345mΩ Rds(on) for predictable conduction losses • 2.7nC typical gate charge for efficient gate drive • 1.7W power dissipation supporting thermal‑budget planning • -55°C to 150°C operating range for wide‑temperature environments

Applications


• Suitable for load switching in automation control modules • Ideal for power‑rail reverse‑polarity protection circuits • Used with battery management and power distribution boards • Can be used for level‑shifting and small‑signal power stages

What package type is used for Compact board layouts?


It is supplied in a SOT‑23 package configured for three‑pin surface mounting, facilitating dense PCB assembly.

How does the device handle gate drive requirements?


The gate may be driven within a ±20V range relative to source, allowing compatibility with common control voltages while limiting gate stress.

What thermal considerations should I allow for in design?


With maximum power dissipation of 1.7W, board copper and thermal vias should be sized to manage junction temperature under load within the -55°C to 150°C specified range.

Are there environmental or material restrictions to note?


The component conforms to RoHS requirements, indicating restricted hazardous substances are controlled in its manufacture.

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