Vishay EF Type N-Channel MOSFET, 13 A, 600 V Enhancement, 3-Pin TO-220 SIHF085N60EF-GE3

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포장 옵션
RS 제품 번호:
279-9909
제조사 부품 번호:
SIHF085N60EF-GE3
제조업체:
Vishay
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Vishay

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

13A

Maximum Drain Source Voltage Vds

600V

Series

EF

Package Type

TO-220

Mount Type

Through Hole

Pin Count

3

Maximum Drain Source Resistance Rds

0.084Ω

Channel Mode

Enhancement

Forward Voltage Vf

1.2V

Maximum Gate Source Voltage Vgs

30V

Maximum Power Dissipation Pd

35W

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

63nC

Maximum Operating Temperature

150°C

Length

10.1mm

Standards/Approvals

RoHS

Automotive Standard

No

Vishay Series EF MOSFET, 600V Maximum Drain Source Voltage, 13A Maximum Continuous Drain Current - SIHF085N60EF-GE3


This MOSFET is a high-voltage N-channel enhancement device intended for power-switching and control stages in through-hole assemblies. It is designed to handle elevated drain-to-source stresses while operating across a wide temperature span, making it suitable for demanding electronic systems that require robust switching and thermal endurance.

Features and Benefits:


• 600V drain capability enabling high-voltage switching applications
• 13A continuous drain current for sustained power delivery
• 0.084Ω low on-resistance reduces conduction losses
• 35W power dissipation supports moderate thermal loading
• 63nC typical gate charge allows predictable switching behaviour
• Vgs rating ±30V for robust gate-drive tolerances

Applications


• Suitable for high-voltage power converters and inverters
• Ideal for industrial motor-drive switching stages
• Used with power supplies requiring through-hole mounting
• Can be used for switch-mode power supplies in industrial equipment
• Suitable for prototype and repair work on legacy power systems

What mounting style does it require and how does that affect thermal handling?


It uses a TO-220 through-hole package which permits bolting to a heatsink for improved thermal dissipation and straightforward PCB assembly.

What gate-drive considerations are necessary for efficient switching?


Design the driver to supply sufficient charge for the 63nC typical gate charge to achieve desired rise/fall times while avoiding excessive gate stress near the ±30V limit.

How does the device perform across temperature extremes?


It is rated to operate from -55°C up to 150°C, allowing use in environments with significant thermal variation while maintaining electrical characteristics.

What is the forward conduction characteristic relevant to diode conduction paths?


The forward voltage specification is 1.2V, which informs loss calculations when body diode conduction occurs during switching or reverse-current events.

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