Vishay SIHH Type N-Channel MOSFET, 30 A, 650 V Enhancement, 4-Pin PowerPAK 8 x 8 SIHH085N60EF-T1GE3

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포장 옵션
RS 제품 번호:
268-8301
제조사 부품 번호:
SIHH085N60EF-T1GE3
제조업체:
Vishay
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Vishay

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

30A

Maximum Drain Source Voltage Vds

650V

Package Type

PowerPAK 8 x 8

Series

SIHH

Mount Type

Surface

Pin Count

4

Maximum Drain Source Resistance Rds

0.085Ω

Channel Mode

Enhancement

Forward Voltage Vf

1.2V

Typical Gate Charge Qg @ Vgs

63nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

184W

Maximum Operating Temperature

150°C

Standards/Approvals

RoHS

Length

8mm

Automotive Standard

No

COO (Country of Origin):
TW

Vishay SIHH Series MOSFET, 650V Maximum Drain Source Voltage, 30A Maximum Continuous Drain Current - SIHH085N60EF-T1GE3


This MOSFET is a high-voltage N-channel switching transistor designed for surface-mounted power applications. It operates across a wide temperature span and is suited to systems requiring robust drain-source voltage tolerance and substantial continuous current handling. The device meets RoHS requirements and is supplied in a compact PowerPAK 8x8 package for low-profile board mounting.

Features and Benefits:


• 650V drain-source rating for elevated-voltage switching
• 30A continuous drain current for sustained load handling
• 0.085Ω Rds(on) for reduced conduction losses
• 184W maximum dissipation for high-power thermal margin
• ±30V gate tolerance to accommodate varied gate-drive levels
• 63nC gate charge enabling predictable switching energy

Applications


• Suitable for high-voltage power supplies and inverters
• Ideal for motor-drive front-end switching stages
• Used with DC-DC converters requiring high power handling
• Can be used for industrial switch-mode power supplies
• Suitable for telecoms and server power-conversion modules

What thermal environment can it tolerate during operation?


The device is specified to function from -55°C up to 150°C, allowing deployment in demanding thermal conditions when paired with appropriate thermal management.

How does the package support board-level implementation?


The PowerPAK 8x8 surface-mount format provides a low-profile footprint with a four-pin arrangement suited to automated assembly and efficient PCB thermal routing.

What is the channel mode and its implication for circuit design?


It is an enhancement-mode N-channel device, so it requires a positive gate-to-source drive to switch on, enabling straightforward high-side or low-side switching topologies with appropriate gate drivers.

Are there environmental or regulatory material considerations?


The component conforms to RoHS material restrictions, indicating it is free from certain restricted substances for compliance-driven designs.

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