Vishay EF Type N-Channel Power MOSFET, 26 A, 650 V Depletion, 4-Pin PowerPAK 8 x 8 SiHH105N60EF-T1GE3

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포장 옵션
RS 제품 번호:
239-8632
제조사 부품 번호:
SiHH105N60EF-T1GE3
제조업체:
Vishay
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모두 선택

브랜드

Vishay

Product Type

Power MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

26A

Maximum Drain Source Voltage Vds

650V

Package Type

PowerPAK 8 x 8

Series

EF

Mount Type

Surface

Pin Count

4

Maximum Drain Source Resistance Rds

0.091Ω

Channel Mode

Depletion

Maximum Power Dissipation Pd

174W

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

33nC

Maximum Gate Source Voltage Vgs

30V

Forward Voltage Vf

1.2V

Maximum Operating Temperature

+150°C

Standards/Approvals

RoHS

Automotive Standard

AEC-Q101

Vishay Series EF Power MOSFET, 650V Drain Source Voltage, 26A Continuous Drain Current - SiHH105N60EF-T1GE3


This power MOSFET is a high-voltage, N‑channel device intended for switching and power-conversion roles in automotive and industrial electronics. It operates across a wide temperature span and is designed as a surface‑mount component for Compact assemblies, providing robust high-voltage switching where thermal endurance and automotive qualification are required.

Features and Benefits:


• 650V drain voltage enables high-voltage switching applications • 26A continuous drain current supports sustained load currents • 0.091Ω low Rds(on) reduces conduction losses in switching stages • 174W power dissipation allows higher power handling in Compact layouts • 33nC typical gate charge facilitates controlled gate‑drive energy • ±30V gate tolerance accommodates varied gate‑drive voltages

Applications


• Suitable for automotive power converters and traction systems • Ideal for high-voltage switch‑mode power supplies in industrial automation • Used for inverter stages in motor‑drive • Can be used for primary‑side switching in SMPS topologies

What thermal range can this device tolerate during operation?


It is rated to operate from -55°C up to +150°C, allowing use in environments with large temperature variations.

How does the pin count and mounting affect PCB layout?


The four‑pin surface‑mount PowerPAK 8x8 package simplifies thermal routing and allows low‑inductance connections for high‑speed switching.

What gate‑drive considerations are necessary for reliable switching?


Gate drive should respect the ±30V maximum Vgs and be designed to manage the 33nC gate charge to control switching speed and minimise EMI.

Is the device suitable for automotive qualification requirements?


It complies with the AEC‑Q101 standard and is RoHS compliant, meeting typical automotive component acceptance criteria.

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