Infineon IPL N-Channel MOSFET, 27 A, 600 V Enhancement, 5-Pin ThinPAK IPL60R125P7AUMA1

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포장 옵션
RS 제품 번호:
217-2538
제조사 부품 번호:
IPL60R125P7AUMA1
제조업체:
Infineon
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모두 선택

브랜드

Infineon

Product Type

MOSFET

Channel Type

N

Maximum Continuous Drain Current Id

27A

Maximum Drain Source Voltage Vds

600V

Series

IPL

Package Type

ThinPAK

Mount Type

Surface

Pin Count

5

Maximum Drain Source Resistance Rds

125mΩ

Channel Mode

Enhancement

Maximum Gate Source Voltage Vgs

20V

Forward Voltage Vf

900mV

Minimum Operating Temperature

-40°C

Typical Gate Charge Qg @ Vgs

36nC

Maximum Power Dissipation Pd

111W

Maximum Operating Temperature

150°C

Standards/Approvals

No

Width

8.8mm

Height

1.1mm

Length

8.8mm

Automotive Standard

No

Infineon IPL Series MOSFET, 600V Drain Source Voltage, 27A Continuous Drain Current - IPL60R125P7AUMA1


This MOSFET is a high-voltage switching transistor designed for surface-mounted power conversion and control applications. It operates in enhancement mode with an N-type channel and is intended for use where elevated voltage handling and substantial continuous current are required. The device suits thermal environments that span well below freezing to high-temperature operation.

Features and Benefits:


• 600V rating enables high-voltage switching in Compact circuits
• 27A continuous drain current supports sustained load driving
• 0.125Ω RDS(on) minimises conduction losses under load
• 111W power dissipation allows high thermal throughput
• 36nC gate charge balances switching speed and drive requirements

Applications


• Suitable for high-voltage DC-DC converters in industrial systems
• Ideal for motor drive front-ends requiring sustained current
• Can be used for power-factor-correction stages in supplies
• Used with solid-state relays and electronic switching modules
• Suitable for high-temperature power assemblies up to 150°C

What gate drive considerations should I allow for?


The gate requires a drive capable of supplying a typical gate charge of 36nC to achieve expected switching performance while respecting a maximum gate-source voltage of 20V.

How should thermal design account for dissipation?


Thermal layout must accommodate a maximum power dissipation of 111W, using appropriate PCB copper area or thermal vias and heatsinking to maintain junction temperatures within rated limits.

Which package and mounting approach does it use?


It is supplied in a ThinPAK surface-mount package with five pins to facilitate low-inductance connections and Compact board placement.

What are the safe operating temperature limits?


The device functions over a wide range from −40°C up to 150°C, permitting use in both cold-start and elevated-temperature environments.

What voltage and current stresses are permissible on the drain?


The drain may be exposed to a maximum of 600V and a continuous current up to 27A, while ensuring RDS(on) and power dissipation remain within specified values.

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