Vishay N-Channel MOSFET, 12 A, 30 V, 8-Pin PowerPAK 1212-8 SIS412DN-T1-GE3

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₩19,880.00

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20 - 740₩994.00₩19,880.00
760 - 1480₩968.00₩19,380.00
1500 +₩954.00₩19,080.00

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포장 옵션
RS 제품 번호:
180-7909
제조사 부품 번호:
SIS412DN-T1-GE3
제조업체:
Vishay
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모두 선택

브랜드

Vishay

Channel Type

N

Product Type

MOSFET

Maximum Continuous Drain Current Id

12A

Maximum Drain Source Voltage Vds

30V

Package Type

PowerPAK 1212-8

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.03Ω

Typical Gate Charge Qg @ Vgs

3.8nC

Maximum Power Dissipation Pd

15.6W

Minimum Operating Temperature

-55°C

Forward Voltage Vf

1.2V

Maximum Gate Source Voltage Vgs

20V

Maximum Operating Temperature

150°C

Height

0.79mm

Length

3.61mm

Width

3.61mm

Standards/Approvals

IEC 61249-2-21

Automotive Standard

No

COO (Country of Origin):
CN

Vishay MOSFET, 30V Maximum Drain Source Voltage, 12A Maximum Continuous Drain Current - SIS412DN-T1-GE3


This MOSFET is a surface‑mounted N‑channel transistor designed for power switching in compact electronic systems. It operates at a maximum drain-source voltage of 30V and supports sustained drain currents suitable for medium‑power applications. The component is intended for board‑level mounting in designs where low conduction losses and moderate power handling are required, functioning reliably across a broad temperature span.

Features and Benefits:


• Low on‑resistance of 0.03 Ω for reduced conduction losses
• Maximum continuous drain current 12A for higher load capability
• Typical gate charge Qg 3.8 nC enabling faster switching transitions
• Power dissipation rating 15.6W for sustained thermal performance
• Gate-source voltage tolerance ±20V for drive flexibility
• Operating range from -55 to 150 °C for wide‑temperature deployment

Applications


• Suitable for synchronous buck converters in compact supplies
• Ideal for battery management and power‑distribution stages
• Used with motor drivers requiring high current switching
• Can be used for load switches in telecommunications equipment
• Useful in LED drivers where low Rds(on) reduces heat

What package type should I expect for footprint planning?


The device is supplied in a PowerPAK 1212‑8 surface‑mount package measuring 3.61 x 3.61mm, allowing high‑density PCB layouts and efficient thermal contact to copper planes.

How does the device behave thermally under load?


At its maximum power dissipation of 15.6W the device requires appropriate PCB thermal design since junction‑to‑ambient heat must be managed to stay within the 150 °C maximum operating temperature.

What switching characteristics affect driver selection?


With a typical gate charge of 3.8 nC the gate drive must supply short current pulses during transitions

this lowers switching losses but requires consideration of driver peak current and gate resistance.

Are there limits on reverse conduction for use in synchronous circuits?


The forward voltage is specified as 1.2V so body‑diode conduction and recovery behaviour should be evaluated in synchronous‑rectification topologies to assess losses during reverse current events.

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