Infineon HybridPACK Drive G2 Type N-Channel MOSFET, 390 A, 1200 V Enhancement HybridPACK Drive G2 FS02MR12A8MA2BBPSA1
- RS 제품 번호:
- 349-031
- 제조사 부품 번호:
- FS02MR12A8MA2BBPSA1
- 제조업체:
- Infineon
Subtotal (1 unit)*
₩5,424,033.12
일시적 품절
- 2026년 11월 02일 부터 배송
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수량 | 한팩당 |
|---|---|
| 1 + | ₩5,424,033.12 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 349-031
- 제조사 부품 번호:
- FS02MR12A8MA2BBPSA1
- 제조업체:
- Infineon
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Infineon | |
| Product Type | MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 390A | |
| Maximum Drain Source Voltage Vds | 1200V | |
| Package Type | HybridPACK Drive G2 | |
| Series | HybridPACK Drive G2 | |
| Mount Type | Screw | |
| Maximum Drain Source Resistance Rds | 5.5mΩ | |
| Channel Mode | Enhancement | |
| Forward Voltage Vf | 6.4V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 200°C | |
| Standards/Approvals | UL 94 V0, RoHS | |
| Automotive Standard | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Infineon | ||
Product Type MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 390A | ||
Maximum Drain Source Voltage Vds 1200V | ||
Package Type HybridPACK Drive G2 | ||
Series HybridPACK Drive G2 | ||
Mount Type Screw | ||
Maximum Drain Source Resistance Rds 5.5mΩ | ||
Channel Mode Enhancement | ||
Forward Voltage Vf 6.4V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 200°C | ||
Standards/Approvals UL 94 V0, RoHS | ||
Automotive Standard No | ||
- COO (Country of Origin):
- DE
The Infineon HybridPACK Drive G2 CoolSiC G2 module is a highly compact B6 bridge power module with enhanced package optimized for various inverter power classes. The power module implements the second generation CoolSiC Automotive MOSFET 1200V, optimized for electric drive train applications, from mid to high range automotive power classes to high range commercial, construction, and agricultural vehicles.
Compact design
High power density
Direct cooled PinFin base plate
High performance Si3N4 ceramic
PCB and cooler assembly guidelines
Integrated temperature sensing diode
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