Molex 0.85 mm Pitch 288 Way, Vertical Through Hole Mount DDR4 Socket ,29V, 0.75A
- RS 제품 번호:
- 693-666
- 제조사 부품 번호:
- 78726-1012
- 제조업체:
- Molex
N
Subtotal (1 tray of 60 units)*
₩416,701.35
제조사가 재고 비축중
- 2026년 6월 12일 부터 배송 준비 완료
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Tray(s) | Per Tray | 한팩당* |
|---|---|---|
| 1 + | ₩416,701.35 | ₩6,945.90 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 693-666
- 제조사 부품 번호:
- 78726-1012
- 제조업체:
- Molex
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | Socket | |
| Memory Socket Type | DIMM | |
| Orientation | Vertical | |
| Insertion/Removal Method | Latched | |
| Contact Material | Copper Alloy | |
| Current | 0.75A | |
| Contact Plating | Gold over Tin | |
| Number of Contacts | 288 | |
| Pitch | 0.85mm | |
| Mount Type | Through Hole | |
| Housing Material | Nylon | |
| SDRAM Type | DDR4 | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -55°C | |
| Latching | Yes | |
| Row Spacing | 1.58mm | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | CSA LR19980 | |
| Series | 78726 | |
| Voltage | 29V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type Socket | ||
Memory Socket Type DIMM | ||
Orientation Vertical | ||
Insertion/Removal Method Latched | ||
Contact Material Copper Alloy | ||
Current 0.75A | ||
Contact Plating Gold over Tin | ||
Number of Contacts 288 | ||
Pitch 0.85mm | ||
Mount Type Through Hole | ||
Housing Material Nylon | ||
SDRAM Type DDR4 | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -55°C | ||
Latching Yes | ||
Row Spacing 1.58mm | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals CSA LR19980 | ||
Series 78726 | ||
Voltage 29V | ||
- COO (Country of Origin):
- CN
The Molex DDR4 DIMM Socket is engineered for vertical through-hole applications, specifically designed to meet the rigorous demands of modern memory module connectivity. This component features a robust construction with 288 circuits, ensuring seamless integration and reliable performance in high-density PCB environments. The precision gold plating provides exceptional conductivity and durability, while the low-halogen materials contribute to environmentally conscious designs. With a recommended PCB thickness of 1.57mm, this socket supports optimal electrical and thermal management, making it Ideal for diverse applications in the realm of memory modules.
288 circuits for high density memory module support
Vertical through-hole design ensures optimal mounting stability
Gold plating for superior electrical conductivity and longevity
Low-halogen materials comply with environmental safety standards
Black housing and latch provide secure and discreet integration
Durable construction rated for up to 25 mating cycles
Compatible with JEDEC MO-309 outline for standardised fit
Designed to operate effectively within a temperature range of -55° to +85°C.
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