Infineon FF1800R12IE5PBPSA1, Type N-Channel Inverter, 1800 A 1200 V, 10-Pin PRIME3, Surface
- RS 제품 번호:
- 218-4331
- 제조사 부품 번호:
- FF1800R12IE5PBPSA1
- 제조업체:
- Infineon
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Subtotal (1 unit)*
₩1,763,064.00
일시적 품절
- 2026년 6월 15일 부터 배송
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수량 | 한팩당 |
|---|---|
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* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 218-4331
- 제조사 부품 번호:
- FF1800R12IE5PBPSA1
- 제조업체:
- Infineon
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Infineon | |
| Product Type | Inverter | |
| Maximum Continuous Collector Current Ic | 1800A | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Maximum Power Dissipation Pd | 20mW | |
| Number of Transistors | 2 | |
| Package Type | PRIME3 | |
| Mount Type | Surface | |
| Channel Type | Type N | |
| Pin Count | 10 | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 2.6V | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | No | |
| Height | 38.25mm | |
| Length | 247mm | |
| Series | FF1800R12IE5P | |
| Width | 86 mm | |
| Automotive Standard | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Infineon | ||
Product Type Inverter | ||
Maximum Continuous Collector Current Ic 1800A | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Maximum Power Dissipation Pd 20mW | ||
Number of Transistors 2 | ||
Package Type PRIME3 | ||
Mount Type Surface | ||
Channel Type Type N | ||
Pin Count 10 | ||
Maximum Collector Emitter Saturation Voltage VceSAT 2.6V | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals No | ||
Height 38.25mm | ||
Length 247mm | ||
Series FF1800R12IE5P | ||
Width 86 mm | ||
Automotive Standard No | ||
The Infineon PrimePack dual IGBT module with TRENCHSTOP IGBT5 and .XT interconnection technology. It has collector emitter voltage of 1800 V. The N-Channel TRENCHSTOP and field stop IGBT Modules are suitable for hard switching and soft switching applications such as high power converters, UPS system, motor drives and solar applications.
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Total losses reduced by up to 20%
Less cooling effort for same output power
Enables higher system overload conditions
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