Fischer Elektronik Heatsink, Universal Square Alu 10 mm 40 mm 40 mm
- RS 제품 번호:
- 674-4769
- 제조사 부품 번호:
- ICK BGA 40x40x10
- 제조업체:
- Fischer Elektronik
대량 구매 할인 기용 가능
Subtotal (1 unit)*
₩6,110.00
제한된 재고
- 63 개 단위 배송 준비 완료
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
수량 | 한팩당 |
|---|---|
| 1 - 49 | ₩6,110.00 |
| 50 - 99 | ₩5,940.80 |
| 100 - 249 | ₩5,715.20 |
| 250 + | ₩5,602.40 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 674-4769
- 제조사 부품 번호:
- ICK BGA 40x40x10
- 제조업체:
- Fischer Elektronik
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 40mm | |
| Width | 40 mm | |
| Height | 10mm | |
| Fastening | Conductive Foil | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | PGA, IC, LED, SMD, PLCC, DIL/IC, BGA | |
| Standards/Approvals | No | |
| Application | Power PC, Cooler, PLCC, Semiconductor, Ic Processors, Fan, Thermal, Microprocessor, SMD, Pin Heat Sinks, PGA, Heat Sink For IC, Bga | |
| Material | Aluminium | |
| Special Features | Effective Heat Dissipation, Pulse Output and Alarm Device Circuit, High-grade Industrial Type, High Mechanical Stability, Flow-favourable Omnidirectional Fin Geometry, High Reliability, Low Current Consumption, Easy Mounting, Compact Design, Excellent Thermal Efficiency | |
| 모두 선택 | ||
|---|---|---|
브랜드 Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 40mm | ||
Width 40 mm | ||
Height 10mm | ||
Fastening Conductive Foil | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type PGA, IC, LED, SMD, PLCC, DIL/IC, BGA | ||
Standards/Approvals No | ||
Application Power PC, Cooler, PLCC, Semiconductor, Ic Processors, Fan, Thermal, Microprocessor, SMD, Pin Heat Sinks, PGA, Heat Sink For IC, Bga | ||
Material Aluminium | ||
Special Features Effective Heat Dissipation, Pulse Output and Alarm Device Circuit, High-grade Industrial Type, High Mechanical Stability, Flow-favourable Omnidirectional Fin Geometry, High Reliability, Low Current Consumption, Easy Mounting, Compact Design, Excellent Thermal Efficiency | ||
- COO (Country of Origin):
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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