Fischer Elektronik Heatsink, Universal Square Alu 10 mm 27 mm 27 mm
- RS 제품 번호:
- 674-4759
- 제조사 부품 번호:
- ICK BGA 27x27x10
- 제조업체:
- Fischer Elektronik
대량 구매 할인 기용 가능
Subtotal (1 unit)*
₩4,718.80
재고있음
- 145 개 단위 배송 준비 완료
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
수량 | 한팩당 |
|---|---|
| 1 - 49 | ₩4,718.80 |
| 50 - 99 | ₩4,512.00 |
| 100 - 249 | ₩4,342.80 |
| 250 + | ₩4,248.80 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 674-4759
- 제조사 부품 번호:
- ICK BGA 27x27x10
- 제조업체:
- Fischer Elektronik
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 27mm | |
| Height | 10mm | |
| Fastening | Clamp, Glue, Integrated clamp, Screw | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | BGA, PGA, LED, PLCC, SMD, DIL/IC | |
| Standards/Approvals | No | |
| Application | Pin Heat Sinks, Heat Sink For Pentium III/Xeon, Heat Sink For Microprocessor, Fan, Cooler, Heat Sink For Dil and Ic, Heat Sink For Pentium Pro, Semiconductor, SMD, Heat Sink For Ic Processor, Heat Sink For PLCC, Heat Sink For Power PC, Heatsink for PGA, Heat Sink For Bga | |
| Material | Aluminium | |
| 모두 선택 | ||
|---|---|---|
브랜드 Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 27mm | ||
Height 10mm | ||
Fastening Clamp, Glue, Integrated clamp, Screw | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type BGA, PGA, LED, PLCC, SMD, DIL/IC | ||
Standards/Approvals No | ||
Application Pin Heat Sinks, Heat Sink For Pentium III/Xeon, Heat Sink For Microprocessor, Fan, Cooler, Heat Sink For Dil and Ic, Heat Sink For Pentium Pro, Semiconductor, SMD, Heat Sink For Ic Processor, Heat Sink For PLCC, Heat Sink For Power PC, Heatsink for PGA, Heat Sink For Bga | ||
Material Aluminium | ||
- COO (Country of Origin):
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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