Fischer Elektronik Heatsink, Universal Square Alu 10 mm 35 mm 35 mm
- RS 제품 번호:
- 674-4765
- 제조사 부품 번호:
- ICK BGA 35x35x10
- 제조업체:
- Fischer Elektronik
대량 구매 할인 기용 가능
Subtotal (1 unit)*
₩3,797.60
재고있음
- 추가로 2026년 4월 13일 부터 49 개 단위 배송
- 추가로 2026년 4월 21일 부터 236 개 단위 배송
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수량 | 한팩당 |
|---|---|
| 1 - 49 | ₩3,797.60 |
| 50 - 99 | ₩3,666.00 |
| 100 - 249 | ₩3,496.80 |
| 250 + | ₩3,440.40 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 674-4765
- 제조사 부품 번호:
- ICK BGA 35x35x10
- 제조업체:
- Fischer Elektronik
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 35mm | |
| Height | 10mm | |
| Fastening | Clamp, Glue, Integrated clamp, Screw, Thermally conductive adhesive | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | PGA, BGA, SMD, PLCC, DIL/IC | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | Heat Sink For Power PC, Semiconductor, Technical Introduction, Heatsink for PGA, SMD, Fan, Hole Pattern, Thermal, Heat Sink For 3 II Mobile Module, Heat Sink For IC, Cooler, Heat Sink For Microprocessor, Heat Sink For Bga, Pin Heat Sinks, Heat Sink For Dil/Ic, Processor Overview, Heat Sink For PLCC | |
| 모두 선택 | ||
|---|---|---|
브랜드 Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 35mm | ||
Height 10mm | ||
Fastening Clamp, Glue, Integrated clamp, Screw, Thermally conductive adhesive | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type PGA, BGA, SMD, PLCC, DIL/IC | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application Heat Sink For Power PC, Semiconductor, Technical Introduction, Heatsink for PGA, SMD, Fan, Hole Pattern, Thermal, Heat Sink For 3 II Mobile Module, Heat Sink For IC, Cooler, Heat Sink For Microprocessor, Heat Sink For Bga, Pin Heat Sinks, Heat Sink For Dil/Ic, Processor Overview, Heat Sink For PLCC | ||
- COO (Country of Origin):
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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