Winbond SLC NAND 32 MB SPI Flash Memory 8-Pin SOIC, W74M32FVSSIQ/TUBE
- RS 제품 번호:
- 171-2240
- 제조사 부품 번호:
- W74M32FVSSIQ/TUBE
- 제조업체:
- Winbond
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현재 액세스할 수 없는 재고 정보
- RS 제품 번호:
- 171-2240
- 제조사 부품 번호:
- W74M32FVSSIQ/TUBE
- 제조업체:
- Winbond
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참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Winbond | |
| Memory Size | 32MB | |
| Product Type | Flash Memory | |
| Interface Type | SPI | |
| Package Type | SOIC | |
| Pin Count | 8 | |
| Maximum Clock Frequency | 104MHz | |
| Mount Type | Surface | |
| Cell Type | SLC NAND | |
| Maximum Supply Voltage | 3.6V | |
| Minimum Supply Voltage | 2.7V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | JEDEC | |
| Height | 1.91mm | |
| Length | 5.38mm | |
| Supply Current | 4mA | |
| Number of Bits per Word | 8 | |
| Automotive Standard | No | |
| Series | W74M | |
| Number of Words | 4M | |
| Maximum Random Access Time | 7ns | |
| 모두 선택 | ||
|---|---|---|
브랜드 Winbond | ||
Memory Size 32MB | ||
Product Type Flash Memory | ||
Interface Type SPI | ||
Package Type SOIC | ||
Pin Count 8 | ||
Maximum Clock Frequency 104MHz | ||
Mount Type Surface | ||
Cell Type SLC NAND | ||
Maximum Supply Voltage 3.6V | ||
Minimum Supply Voltage 2.7V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals JEDEC | ||
Height 1.91mm | ||
Length 5.38mm | ||
Supply Current 4mA | ||
Number of Bits per Word 8 | ||
Automotive Standard No | ||
Series W74M | ||
Number of Words 4M | ||
Maximum Random Access Time 7ns | ||
The W74M32FV (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The W74 series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with low current consumption. All devices are offered in space-saving packages.
More than 20-year data retention
Low Power
Wide Temperature Range
Flexible Architecture with 4KB sectors
Advanced Security Features
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