Bergquist HC5000 Series Self-Adhesive Thermal Gap Pad, 0.1 in Thick, 5 W/mK, 16 in, 8in, Silicone

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RS 제품 번호:
282-6831
제조사 부품 번호:
GAP PAD TGP HC5000, 16in x 8in x 0.1 sh
제조업체:
Bergquist
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브랜드

Bergquist

Product Type

Thermal Gap Pad

Thickness

0.1in

Thermal Conductivity

5W/mK

Self-Adhesive

Yes

Trade Name

HC5000

Conductive Material

Silicone

Width

8in

Standards/Approvals

No

Length

16in

Series

HC5000

제외

COO (Country of Origin):
US
The Bergquist soft and compliant gap filling material with a thermal conductivity of 5.0 W per m K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.

High-compliance low compression stress

Fiberglass reinforced for shear and tear resistance

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