Bergquist HC3000 Series Self-Adhesive Thermal Gap Pad, 0.01 in Thick, 3 W/mK, 16 in, 8in, Silicone
- RS 제품 번호:
- 282-6819
- 제조사 부품 번호:
- GAP PAD TGP HC3000, 16in x 8in x 0.01 sh
- 제조업체:
- Bergquist
현재 비가용
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- RS 제품 번호:
- 282-6819
- 제조사 부품 번호:
- GAP PAD TGP HC3000, 16in x 8in x 0.01 sh
- 제조업체:
- Bergquist
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.01in | |
| Thermal Conductivity | 3W/mK | |
| Self-Adhesive | Yes | |
| Trade Name | HC3000 | |
| Conductive Material | Silicone | |
| Standards/Approvals | No | |
| Width | 8in | |
| Length | 16in | |
| Series | HC3000 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.01in | ||
Thermal Conductivity 3W/mK | ||
Self-Adhesive Yes | ||
Trade Name HC3000 | ||
Conductive Material Silicone | ||
Standards/Approvals No | ||
Width 8in | ||
Length 16in | ||
Series HC3000 | ||
제외
- COO (Country of Origin):
- US
The Bergquist is a soft and compliant gap filling material with a thermal conductivity of 3.0 W per m K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
High-compliance
Low compression stress
Fiberglass reinforced for shear and tear resistance
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