Bergquist TGP 3000 Series Self-Adhesive Thermal Gap Pad, 0.04 in Thick, 3 W/mK, 203 mm, 16in, Silicone

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RS 제품 번호:
282-6768
제조사 부품 번호:
GAP PAD TGP 3000, 8in x 16in x 0.04
제조업체:
Bergquist
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브랜드

Bergquist

Product Type

Thermal Gap Pad

Thickness

0.04in

Thermal Conductivity

3W/mK

Self-Adhesive

Yes

Conductive Material

Silicone

Standards/Approvals

No

Width

16in

Length

203mm

Colour

Light Blue

Maximum Operating Temperature

200°C

Series

TGP 3000

Minimum Operating Temperature

-60°C

제외

COO (Country of Origin):
US
The Bergquist Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material. It is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due to an all new 3 W/m-K filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. It maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and or topography.

Highly conformable

Designed for low-stress applications

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