Lotus Microsystems LTG Series Thermal Pad, 0.7 mm Thick, 150 W/mK, 1.6 mm, 0.8mm, Copper
- RS 제품 번호:
- 881-152P
- 제조사 부품 번호:
- LTG060370CT
- 제조업체:
- Lotus Microsystems
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- RS 제품 번호:
- 881-152P
- 제조사 부품 번호:
- LTG060370CT
- 제조업체:
- Lotus Microsystems
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Lotus Microsystems | |
| Product Type | Thermal Pad | |
| Thickness | 0.7mm | |
| Thermal Conductivity | 150W/mK | |
| Self-Adhesive | No | |
| Trade Name | LTG | |
| Conductive Material | Copper | |
| Width | 0.8mm | |
| Standards/Approvals | RoHS | |
| Length | 1.6mm | |
| Colour | Grey | |
| Series | LTG | |
| Minimum Operating Temperature | -65°C | |
| Maximum Operating Temperature | 150°C | |
| 모두 선택 | ||
|---|---|---|
브랜드 Lotus Microsystems | ||
Product Type Thermal Pad | ||
Thickness 0.7mm | ||
Thermal Conductivity 150W/mK | ||
Self-Adhesive No | ||
Trade Name LTG | ||
Conductive Material Copper | ||
Width 0.8mm | ||
Standards/Approvals RoHS | ||
Length 1.6mm | ||
Colour Grey | ||
Series LTG | ||
Minimum Operating Temperature -65°C | ||
Maximum Operating Temperature 150°C | ||
- COO (Country of Origin):
- TW
The Lotus Microsystems electrically-isolated SMT thermal jumper designed to enhance thermal management in electronic devices by efficiently guiding heat away from critical components.
High thermal conductivity ensures effective heat dissipation
High insulation resistance prevents electrical connectivity
Designed for precise package sizing to fit various applications
Low coefficient of thermal expansion promotes reliability
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