Lotus Microsystems LTG Series Thermal Pad, 0.3 mm Thick, 150 W/mK, Copper

N

본 이미지는 참조용이오니 재확인이 필요하시면 문의해주세요.

현재 비가용
죄송합니다. 언제 재입고될지 모릅니다.
포장 옵션
RS 제품 번호:
881-148P
제조사 부품 번호:
LTG020130CT
제조업체:
Lotus Microsystems
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Lotus Microsystems

Product Type

Thermal Pad

Thickness

0.3mm

Thermal Conductivity

150W/mK

Self-Adhesive

No

Trade Name

LTG

Conductive Material

Copper

Standards/Approvals

RoHS

Colour

Grey

Minimum Operating Temperature

-65°C

Maximum Operating Temperature

150°C

Series

LTG

COO (Country of Origin):
TW
The Lotus Microsystems electrically-isolated SMT thermal jumper designed to effectively manage heat distribution away from hot electronic components, ensuring efficient thermal performance within various applications.

High thermal conductivity enhances heat dissipation

Silicon substrate offers excellent thermomechanical properties

Designed for high precision package sizing

RoHS compliant for environmentally-friendly use

Multiple standard EIA sizes available for compatibility

관련된 링크들