Murata, LQW, 1608 Unshielded Wirewound Surface Mount Inductor with a Non-Magnetic Ceramic Core, 0.022 μH ±5 % 500 mA Idc
- RS 제품 번호:
- 124-8180P
- 제조사 부품 번호:
- LQW18AN22NJ00D
- 제조업체:
- Murata
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- RS 제품 번호:
- 124-8180P
- 제조사 부품 번호:
- LQW18AN22NJ00D
- 제조업체:
- Murata
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Murata | |
| Inductance | 0.022μH | |
| Product Type | Wirewound Surface Mount Inductor | |
| Maximum DC Current | 500mA | |
| Package/Case | 1608 | |
| Packaging | Paper Tape | |
| Length | 1.6mm | |
| Automotive Standard | No | |
| Shielding | No | |
| Minimum Operating Temperature | -55°C | |
| Maximum DC Resistance | 170mΩ | |
| Pin Count | 2 | |
| Maximum Operating Temperature | 125°C | |
| Inductance Tolerance | ±5 % | |
| Series | LQW | |
| Core Material | Non-Magnetic Ceramic | |
| Standards/Approvals | RoHS | |
| Termination Style | Solder | |
| Depth | 0.8mm | |
| Height | 0.8mm | |
| Maximum Self Resonant Frequency | 4600MHz | |
| Minimum Quality Factor | 40 | |
| Moulded | Yes | |
| Inductor Construction | Wirewound | |
| 모두 선택 | ||
|---|---|---|
브랜드 Murata | ||
Inductance 0.022μH | ||
Product Type Wirewound Surface Mount Inductor | ||
Maximum DC Current 500mA | ||
Package/Case 1608 | ||
Packaging Paper Tape | ||
Length 1.6mm | ||
Automotive Standard No | ||
Shielding No | ||
Minimum Operating Temperature -55°C | ||
Maximum DC Resistance 170mΩ | ||
Pin Count 2 | ||
Maximum Operating Temperature 125°C | ||
Inductance Tolerance ±5 % | ||
Series LQW | ||
Core Material Non-Magnetic Ceramic | ||
Standards/Approvals RoHS | ||
Termination Style Solder | ||
Depth 0.8mm | ||
Height 0.8mm | ||
Maximum Self Resonant Frequency 4600MHz | ||
Minimum Quality Factor 40 | ||
Moulded Yes | ||
Inductor Construction Wirewound | ||
Murata 0603 LQW18AN Series Wire Wound Inductors
High quality Coil inductors designed for VHF and UHF applications.
High resonance frequency.
Low tolerance of inductance values.
Models with the suffix '10D' have lower DC resistance values.
Applications: High frequency circuits for wireless telecommunications equipment: Bluetooth, GSM, W-LAN.
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