Infineon SRAM, CY62148ELL-55SXI- 4 MB

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포장 옵션
RS 제품 번호:
124-2941
제조사 부품 번호:
CY62148ELL-55SXI
제조업체:
Infineon
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브랜드

Infineon

Memory Size

4MB

Product Type

SRAM

Organisation

512 k x 8 Bit

Number of Words

512K

Number of Bits per Word

8

Maximum Random Access Time

45ns

Address Bus Width

8bit

Maximum Clock Frequency

1MHz

Timing Type

Asynchronous

Minimum Supply Voltage

4.5V

Mount Type

Surface

Maximum Supply Voltage

5.5V

Minimum Operating Temperature

-40°C

Package Type

SOIC

Maximum Operating Temperature

85°C

Pin Count

32

Height

2.81mm

Length

20.75mm

Standards/Approvals

No

Width

11.43mm

Series

CY62148E

Automotive Standard

No

Supply Current

20mA

Infineon CY62148E Series SRAM, 4MB Memory Size, 1MHz Maximum Clock Frequency - CY62148ELL-55SXI


This SRAM is a static memory device designed for short-term data storage in electronic systems. It operates within typical embedded environments where quick read/write access and simple timing are required. The device is supplied as a surface-mount SOIC package and is intended for designs requiring non-volatile-free volatile memory with an 8-bit data path and 512K words of capacity.

Features and Benefits:


• Asynchronous 45 ns access time delivers fast random reads and writes
• Supports up to 1 MHz clock frequency for responsive memory cycles
• 5.5V maximum supply allows compatibility with higher-voltage systems
• 4.5V minimum supply enables reliable low-voltage operation
• 20 mA supply current provides predictable power budgeting
• Operating range -40 to 85 °C suits deployment across industrial temperatures

Applications


• Suitable for buffering in microcontroller-based systems
• Ideal for temporary data logging in industrial equipment
• Used with control units requiring 8-bit parallel data transfer
• Can be used for firmware shadow RAM in legacy electronics
• Suitable for surface-mount assemblies where SOIC is required

How is addressing organised for system integration?


The memory is arranged as 512K words of 8 bits, accessed through an 8-bit address bus width allowing straightforward byte-oriented addressing.

What package considerations affect PCB layout?


The device is supplied in a 32-pin SOIC surface-mount package, which informs footprint, solder paste mask and thermal considerations during PCB design.

How does the device behave thermally during operation?


It is specified for use from -40 °C to 85 °C, so thermal design should account for ambient extremes and power dissipation driven by its 20 mA supply current.

What pin-count and signalling style should I expect?


The component uses a 32-pin configuration and operates with asynchronous timing, which simplifies timing constraints compared with synchronous memory.

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