Okdo RM117-D2E32W3 ROCK SBC Board
- RS 제품 번호:
- 261-9843
- 제조사 부품 번호:
- RM117-D2E32W3
- 제조업체:
- Okdo
대량 구매 할인 기용 가능
Subtotal (1 Box of 500 units)*
₩27,291,960.00
마지막 RS 재고
- 최종적인 2,500 개 unit(s)이 배송 준비 됨
수량 | 한팩당 | Per Box* |
|---|---|---|
| 500 - 500 | ₩54,583.92 | ₩27,292,242.00 |
| 1000 - 1000 | ₩53,493.52 | ₩26,746,384.00 |
| 1500 + | ₩52,421.92 | ₩26,211,430.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 261-9843
- 제조사 부품 번호:
- RM117-D2E32W3
- 제조업체:
- Okdo
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Okdo | |
| Product Type | ROCK SBC Board | |
| Series | RM117 | |
| Standards/Approvals | CE, FC, RoHS | |
| 모두 선택 | ||
|---|---|---|
브랜드 Okdo | ||
Product Type ROCK SBC Board | ||
Series RM117 | ||
Standards/Approvals CE, FC, RoHS | ||
- COO (Country of Origin):
- CN
The OKdo ROCK 3 Compute Module SODIMM (CM3S) Model A is a highly impressive device that offers an array of features within its compact design. Its based on the Rockchip RK3566 System on Chip (SoC), which boasts a robust CPU, a Power Management Unit (PMU), DRAM memory, eMMC storage, as well as wireless connectivity through WiFi 4 and BT 4.2. All these components are packed into a compact DDR2 SODIMM form factor, measuring just 67.6mm x 32mm.
The CM3S is a cost-effective, and highly versatile solution for a wide range of applications. Despite its small size, this device is a true powerhouse. This variant offers 2GB of LPDDR4 RAM and a 32GB eMMC storage, as well as Wi-Fi and Bluetooth configuration. ;The CM3S accelerates product development by providing a powerful SoM in a compact form factor. With a simple carrier board (a 2-layer baseboard is sufficient to provide access to all functions of the SoM), engineers can rapidly develop solutions and prepare the boards for production.;Please note: The images above show a CM3S-specific model. This model has certain features like wireless communication capabilities or eMMC. Depending on the purchased SKU there might be variations to the populated components.
Hardware
CPU: Quad‑core Arm® Cortex®‑A55 (ARMv8) 64‑bit @ 1.6GHz ;GPU: Arm Mali™‑G52‑2EE, OpenGL® ES1.1/2.0/3.0/3.1/3.2, Vulkan® 1.1, OpenCL™ 2.1 ;NPU: 0.8 TOPs@INT8, support INT8, INT16, FP16, BFP16, support deep learning frameworks such as TensorFlow, Caffe, Tflite, Pytorch, Onnx, Android™ NN, etc ;Memory: 32bit LPDDR4X 2GB ;Storage: eMMC 5.1 32GB;Display: Single display engine, HDMI2.0, Dual MIPI‑DSI ;Multi‑Media: 4K H.265/H.264/VP9 video decoder and 1080p@60fps H.264/H.265 video encoder ;Video input: 8M Pixel ISP and 1 x 4 lanes or 2 x 2 lanes MIPI CSI‑2 and DVP interface ;Audio interface: I2S0/I2S1 with 8 channels, IS2/I2S3 with 2 channels ;High-Speed Interface: One SATA 3.0/PCIe 2.1 combo port, and one USB 2.0 OTG ;Security: Arm TrustZone® security extension, Secure Video Path, Secure JTAG to de-bug, Secure boot, OTP and Crypto (AES/TDES/SM4/SM3/SHA256/SHA512/RSA)
Interfaces
802.11 b/g/n Wireless LAN (Wi‑Fi 4) ;BT 4.2 with BLE ;up to 5 x I2C;up to 3 x SPI ;up to 8 x UART ;up to 12 x PWM ;up to 60x GPIO ;1 x ADC ;2 x I2S ;1 x PCIe 2.0, 1 lane host (5Gbps) ;1 x SATA 3.0(shared with PCIe) ;1 x USB 2.0 OTG ;1 x SDIO 3.0 ;1 x HDMI up to 4K x 2k@60Hz ;2 x 2 lane or 1 x 4 lane MIPI CSI camera port ;1 x MIPI DSI 2 lane @ 1.6Gbps per lane ;1 x MIPI DSI 4 lane @ 1.6Gbps per lane ;3.3V ∼ 5V power input ;260 pins SODIMM golden finger edge connector
Let's work together
OKdo has manufacturing capabilities and technical engineering consultants to support long-term stock availability and design longevity. If you would like to collaborate on your next project, lets design the future together: contact sales@okdo.com
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