Infineon 40 V 750 mA Schottky Diode Schottky SOD-323 BAT165E6327HTSA1

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₩660,000.00

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RS 제품 번호:
249-6996
제조사 부품 번호:
BAT165E6327HTSA1
제조업체:
Infineon
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브랜드

Infineon

Product Type

Schottky Diode

Mount Type

Surface

Package Type

SOD-323

Maximum Continuous Forward Current If

750mA

Peak Reverse Repetitive Voltage Vrrm

40V

Diode Configuration

Single

Series

BAT165

Rectifier Type

Schottky

Peak Reverse Current Ir

900μA

Minimum Operating Temperature

-65°C

Peak Non-Repetitive Forward Surge Current Ifsm

2.5A

Maximum Forward Voltage Vf

700mV

Maximum Operating Temperature

150°C

Standards/Approvals

AEC-Q101

Automotive Standard

AEC-Q101

Infineon BAT165 Series Schottky Diode, 40V Peak Reverse Repetitive Voltage, 750mA Maximum Continuous Forward Current - BAT165E6327HTSA1


This Schottky diode is a single-element rectifier designed for surface-mounted applications where fast switching and low forward drop are required. It operates across a wide temperature range and meets automotive qualification standards, making it suitable for electrically demanding environments that need compact, low-loss rectification.

Features and Benefits:


• Low forward drop reduces conduction losses during switching
• 750mA continuous current supports moderate load currents
• 40V reverse rating protects against typical reverse-voltage events
• 900μA Peak reverse leakage minimises off-state current draw
• Withstands 150°C for high-temperature operating environments

Applications


• Suitable for automotive power-rail protection and rectification
• Used with DC power supplies in Compact modules
• Ideal for battery-charging and reverse-polarity prevention circuits
• Can be used for high-density surface-mount assemblies
• Used for transient handling in low-voltage power management

What temperature range can it operate within?


It functions from -65°C up to 150°C, ensuring operation across extreme thermal conditions.

How does it perform under surge conditions?


It tolerates a 2.5A non-repetitive forward surge to handle short-duration inrush events.

What mounting style is required for assembly?


It is intended for surface-mount placement in an SOD-323 package footprint.

What automotive qualification does it meet?


It complies with AEC-Q101 standards for automotive semiconductor qualification.

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