ROHM 650 V 20 A Diode 3-Pin TO-220ACGE SCS320AGC16
- RS 제품 번호:
- 265-182
- 제조사 부품 번호:
- SCS320AGC16
- 제조업체:
- ROHM
대량 구매 할인 기용 가능
Subtotal (1 pack of 1 unit)*
₩10,699.08
일시적 품절
- 2026년 1월 26일 부터 100 개 단위 배송
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팩 | 한팩당 |
|---|---|
| 1 - 9 | ₩10,699.08 |
| 10 - 99 | ₩9,638.76 |
| 100 - 499 | ₩8,888.64 |
| 500 - 999 | ₩8,243.80 |
| 1000 + | ₩7,390.28 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 265-182
- 제조사 부품 번호:
- SCS320AGC16
- 제조업체:
- ROHM
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | ROHM | |
| Product Type | Diode | |
| Mount Type | Through Hole | |
| Package Type | TO-220ACGE | |
| Maximum Continuous Forward Current If | 20A | |
| Peak Reverse Repetitive Voltage Vrrm | 650V | |
| Series | SCS320 | |
| Pin Count | 3 | |
| Peak Reverse Current Ir | 400μA | |
| Maximum Forward Voltage Vf | 1.71V | |
| Peak Non-Repetitive Forward Surge Current Ifsm | 450A | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 ROHM | ||
Product Type Diode | ||
Mount Type Through Hole | ||
Package Type TO-220ACGE | ||
Maximum Continuous Forward Current If 20A | ||
Peak Reverse Repetitive Voltage Vrrm 650V | ||
Series SCS320 | ||
Pin Count 3 | ||
Peak Reverse Current Ir 400μA | ||
Maximum Forward Voltage Vf 1.71V | ||
Peak Non-Repetitive Forward Surge Current Ifsm 450A | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
The ROHM SiC Schottky Barrier Diode designed to deliver exceptional efficiency and reliability for your demanding applications. This diode ensures faster switching times, making it an excellent choice for high-speed designs. With its robust construction and advanced technology, the SCS320AG excels in handling high surge currents while exhibiting a remarkable thermal stability that withstands extreme conditions.
Handles high surge currents with stable operation
Designed for optimal heat dissipation in a compact package
Exhibits excellent thermal stability across varying conditions
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