Infineon Low Side 2, Low Side Power Switch Power Switch IC 8-Pin, SOIC

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Subtotal (1 reel of 2500 units)*

₩3,790,000.00

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2500 - 2500₩1,516.00₩3,787,500.00
5000 - 22500₩1,484.00₩3,712,000.00
25000 +₩1,440.00₩3,600,500.00

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RS 제품 번호:
919-6646
제조사 부품 번호:
BTS3410GXUMA1
제조업체:
Infineon
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브랜드

Infineon

Product Type

Power Switch IC

Power Switch Type

Low Side Power Switch

Power Switch Topology

Low Side

Switch On Resistance RdsOn

480mΩ

Power Rating

0.8W

Number of Inputs

2

Mount Type

Surface

Minimum Supply Voltage

-0.2V

Package Type

SOIC

Pin Count

8

Maximum Supply Voltage

10V

Operating Current

1.65A

Maximum Operating Temperature

150°C

Minimum Operating Temperature

-40°C

Height

1.45mm

Length

5mm

Standards/Approvals

No

Series

HITFET

Automotive Standard

No

COO (Country of Origin):
AT

Infineon HITFET Series Power Switch IC, 0.8W Power Rating, 1.65A Operating Current - BTS3410GXUMA1


This power switch IC is a dual low-side switching device designed for surface-mount applications where compact, controlled load switching is required. It provides two independent input-to-output channels in an SOIC 8-pin package and is intended for use in electronics that demand moderate switching current and clear thermal headroom. The device operates across a wide temperature span and is suitable for integration onto densely populated assemblies.

Features and Benefits:


• 480mΩ Rds(on) enabling low conduction losses during switching
• 1.65A operating current supporting moderate load demands
• 10V maximum supply for low-voltage control systems
• 0.8W power rating aiding thermal budgeting in designs
• Two outputs with two inputs allowing independent channel control

Applications


• Used for controlling auxiliary loads in vehicle electronics
• Suitable for low-voltage power distribution modules
• Ideal for motor driver pre-drive or sensor supply switching
• Can be used for board-level power gating in industrial controls

What package and mounting style does it use for PCB placement?


It arrives in an SOIC 8-pin package designed for surface-mount soldering, facilitating automated assembly and compact board layouts.

How does the device cope with elevated temperatures during operation?


It is specified to operate up to 150°C, which permits use in environments with significant thermal stress while maintaining switching capability.

What are the input/output configuration limits developers should consider?


The component has two inputs and two outputs, allowing independent control of each channel within the device’s electrical limits.

What operating temperature floor is specified for cold environments?


The device is rated to function down to -40°C, enabling deployment in low-temperature applications.

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