STMicroelectronics Demonstration Board for VNI8200XP for High Side Driver
- RS 제품 번호:
- 196-1763
- 제조사 부품 번호:
- STEVAL-IFP022V1
- 제조업체:
- STMicroelectronics
대량 구매 할인 기용 가능
Subtotal (1 unit)*
₩151,152.00
제한된 재고
- 추가로 2025년 12월 08일 부터 3 개 단위 배송
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수량 | 한팩당 |
|---|---|
| 1 - 4 | ₩151,152.00 |
| 5 + | ₩148,144.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 196-1763
- 제조사 부품 번호:
- STEVAL-IFP022V1
- 제조업체:
- STMicroelectronics
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | STMicroelectronics | |
| For Use With | High Side Driver | |
| Kit Classification | Evaluation Board | |
| Featured Device | VNI8200XP | |
| Kit Name | Demonstration Board | |
| 모두 선택 | ||
|---|---|---|
브랜드 STMicroelectronics | ||
For Use With High Side Driver | ||
Kit Classification Evaluation Board | ||
Featured Device VNI8200XP | ||
Kit Name Demonstration Board | ||
- COO (Country of Origin):
- IT
The STEVAL-IFP022V1 demonstration board is based on VNI8200XP high-side driver. It was developed as an instrument to test device functionality in terms of power management and digital interface. The boards isolated interface between the IPS and host controller were implemented using high-speed opto-couplers for IPS driving, and low-speed opto-couplers to receive device status information. The connection is achieved through a 30-pin connector.
To provide a user-friendly way to test VNI8200XP device functionality, a GUI interface was developed. To use the GUI it is necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a communication board.
Thermal performance is improved thanks to a four-layer structure which makes it possible to design a copper area distributed in all the layers for more effective heat dissipation.
To provide a user-friendly way to test VNI8200XP device functionality, a GUI interface was developed. To use the GUI it is necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a communication board.
Thermal performance is improved thanks to a four-layer structure which makes it possible to design a copper area distributed in all the layers for more effective heat dissipation.
For these non-cancellable (NC), and non-returnable (NR) products, Terms and Conditions apply.
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