PUI Audio Lead Wire Piezo Buzzer Component 109.9 mm 15V Max

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Subtotal 10 units (supplied in a bag)*

₩21,800.00

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10 - 99₩2,180.00
100 - 499₩1,980.00
500 - 999₩1,840.00
1000 +₩1,500.00

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포장 옵션
RS 제품 번호:
276-798P
제조사 부품 번호:
AB1070B-LW100-R
제조업체:
PUI Audio
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브랜드

PUI Audio

Mount Type

Lead Wire

Product Type

Piezo Buzzer Component

Maximum Supply Voltage

15V

Diameter

9.9mm

Minimum Operating Temperature

-20°C

Maximum Operating Temperature

80°C

Standards/Approvals

RoHS/REACH Exempt

Termination Style

Lead Wire

Length

109.9mm

Depth

100μm

Maximum Frequency

1000Hz

COO (Country of Origin):
CN

PUI Audio Piezo Buzzer Component, 10000pF Capacitance, 1000Hz Maximum Frequency - AB1070B-LW100-R


This piezo buzzer component provides audible signalling for electronic and electromechanical systems, converting electrical input into sound within low-frequency applications. It is intended for integration where Compact acoustic alerts are required and operates across a wide thermal range suitable for many industrial environments.

Features and Benefits:


• Maximum frequency 1000Hz delivers clear low-frequency alerts
• Operates from supply voltages up to 15V for flexible power options
• Wide temperature tolerance from -20°C to 80°C for harsh environments
• High capacitance 10000pF supports stable acoustic response
• Lead wire termination eases through-panel and harness connections
• RoHS/REACH exempt classification simplifies material considerations

Applications


• Suitable for industrial control panels requiring audible warnings
• Ideal for automation equipment status indications
• Used for electronic prototypes needing a miniature buzzer element
• Can be used for safety interlocks in electrical cabinets
• Used with sensor modules to provide event-driven alerts

What mounting method does the component use for wiring connections?


It uses flexible lead wires as the termination method, enabling soldering or connector attachment into harnesses without surface-mount techniques.

How thin is the Active piezo element and what does that mean for integration?


The disc has a low-profile thickness of 0.1mm, allowing it to be embedded into slim assemblies or stacked within constrained cavities.

What form factor should designers expect for space planning?


The part has a circular footprint with a diameter of 9.9mm and Compact depth of 9.9mm, permitting placement in miniature enclosures.

Which performance parameter should be considered for filter and drive circuitry?


The device presents a capacitance of 10000pF, so drive stages should account for this reactive load when designing emitter or driver output stages.

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