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onsemi MICROFJ-30035-TSV-TR1 Infrared Photodiode, 65 °, Surface SMT

Name: onsemi MICROFJ-30035-TSV-TR1 Infrared Photodiode, 65 °, Surface SMT
Brand: onsemi
SKU: 185-9624
Availability: InStock

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₩85,900.00

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모두 선택	제품 정보	값
	브랜드	onsemi
	Product Type	Photodiode
	Spectrums Detected	Infrared
	Wavelength of Peak Sensitivity	970nm
	Package Type	SMT
	Packaging	Tape & Reel
	Mount Type	Surface
	Number of Pins	4
	Minimum Wavelength Detected	200nm
	Maximum Wavelength Detected	900nm
	Typical Fall Time	0.6ns
	Amplified	No
	Minimum Operating Temperature	-25°C
	Maximum Operating Temperature	85°C
	Length	3.16mm
	Width	3.16mm
	Standards/Approvals	RoHS
	Height	0.46mm
	Angle of Half Sensitivity	65 °
	Typical Rise Time	0.6ns
	Polarity	Forward
	Series	J
	Automotive Standard	No
	Breakdown Voltage	24.7V
	Dark Current	1nA

	모두 선택
	브랜드 onsemi
	Product Type Photodiode
	Spectrums Detected Infrared
	Wavelength of Peak Sensitivity 970nm
	Package Type SMT
	Packaging Tape & Reel
	Mount Type Surface
	Number of Pins 4
	Minimum Wavelength Detected 200nm
	Maximum Wavelength Detected 900nm
	Typical Fall Time 0.6ns
	Amplified No
	Minimum Operating Temperature -25°C
	Maximum Operating Temperature 85°C
	Length 3.16mm
	Width 3.16mm
	Standards/Approvals RoHS
	Height 0.46mm
	Angle of Half Sensitivity 65 °
	Typical Rise Time 0.6ns
	Polarity Forward
	Series J
	Automotive Standard No
	Breakdown Voltage 24.7V
	Dark Current 1nA

High-density microcells

J-Series sensors feature ON Semiconductor's unique 'fast output' terminal

Temperature stability of 21.5 mV/°C

Exceptional breakdown voltage uniformity of ±250 mV

Available in a reflow solder compatible TSV chip-scale package

Ultra-low dark count rates of 50 kHz/mm2 typical

Optimized for high-performance timing applications, such as ToF-PET

3 mm, 4 mm and 6 mm sensor sizes

Bias voltage of <30 V

Results in a 50% photon detection efficiency (PDE) at 420 nm

Improved signal rise time and the microcell recovery time

Negates the need for active voltage control

Industry-leading uniformity

TSV package results in almost zero deadspace allowing the creation of high fill factor arrays and is ferrous-metal free

Applications

Medical Imaging

Hazard & Threat

3D Ranging & Sensing

Biophotonics & Sciences

High Energy Physics

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