제조사부품번호

Molex Nano-Pitch Series Vertical Through Hole PCB Socket, 2 Row, 0.5 mm Pitch Solder

RS 제품 번호:: 161-8004
제조사 부품 번호:: 171983-2042
제조업체:: Molex

Molex Nano-Pitch Series Vertical Through Hole PCB Socket, 2 Row, 0.5 mm Pitch Solder

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대량 구매 할인 기용 가능

Subtotal (1 reel of 490 units)*

₩5,386,256.40

일시적 품절

2026년 7월 20일 부터 배송

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수량	한팩당	릴당*
490 - 490	₩10,992.36	₩5,386,164.28
980 - 1470	₩10,772.40	₩5,278,383.88
1960 +	₩10,556.20	₩5,172,814.36

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:: 161-8004
제조사 부품 번호:: 171983-2042
제조업체:: Molex

참조 문서

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제품 세부 사항

제품 정보를 선택해 유사 제품을 찾기

모두 선택	제품 정보	값
	브랜드	Molex
	Product Type	PCB Socket
	Number of Rows	2
	Sub Type	PCB Socket
	Pitch	0.5mm
	Current	50mA
	Housing Material	Glass Filled Thermoplastic
	Termination Type	Solder
	Mount Type	Through Hole
	Orientation	Vertical
	Connector System	Wire-to-Board
	Voltage	30 V
	Series	Nano-Pitch
	Minimum Operating Temperature	-40°C
	Row Pitch	0.5mm
	Maximum Operating Temperature	80°C
	Contact Material	Copper Alloy
	Contact Plating	Gold
	Contact Gender	Female
	Standards/Approvals	RoHS

	모두 선택
	브랜드 Molex
	Product Type PCB Socket
	Number of Rows 2
	Sub Type PCB Socket
	Pitch 0.5mm
	Current 50mA
	Housing Material Glass Filled Thermoplastic
	Termination Type Solder
	Mount Type Through Hole
	Orientation Vertical
	Connector System Wire-to-Board
	Voltage 30 V
	Series Nano-Pitch
	Minimum Operating Temperature -40°C
	Row Pitch 0.5mm
	Maximum Operating Temperature 80°C
	Contact Material Copper Alloy
	Contact Plating Gold
	Contact Gender Female
	Standards/Approvals RoHS

COO (Country of Origin):: CN

Molex Nano-Pitch I/O Receptacles

From Molex, a series of high density, high performance, low profile I/O connectors. The Nano-Pitch connectors support multi-protocol high-speed demands needed in the latest industry wire to board applications. With their Compact design and 0.50 mm pitch, the Nano I/O connectors provide a versatile interconnect solution for both internal and external applications. Available in right angle and vertical options in both surface mount and through hole.

Features and Benefits

Compact design – Enables high speed and high bandwidth in a small form I/O connector

Multi-protocol solution – SAS-G3, SAS-G4, PCIe

Flexible pinout – Maximises the number of high-speed lanes.

Vertical and right angle PCB mounting – Allows for greater design flexibility

Metal Shell housing – Providing internal and external solution. Low mated height, fits max component height of PCIe and add in cards

Applications

Hubs

Switches

Routers

Servers

Storage Controllers

Storage Racks

Data Centres

Molex Nano-Pitch Series Vertical Through Hole PCB Socket, 2 Row, 0.5 mm Pitch Solder

Molex Nano-Pitch I/O Receptacles

Features and Benefits

Applications

Molex Nano-Pitch I/O Interconnect System

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