Molex PMC Mezzanine Series Straight Surface PCB Header, 64 Contact(s), 1 mm Pitch, 2 Row, Shrouded
- RS 제품 번호:
- 670-6482
- 제조사 부품 번호:
- 71436-0864
- 제조업체:
- Molex
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Subtotal (1 unit)*
₩12,445.60
일시적 품절
- 2026년 6월 29일 부터 배송
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수량 | 한팩당 |
|---|---|
| 1 - 239 | ₩12,445.60 |
| 240 - 479 | ₩12,182.40 |
| 480 + | ₩11,825.20 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 670-6482
- 제조사 부품 번호:
- 71436-0864
- 제조업체:
- Molex
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | PCB Header | |
| Series | PMC Mezzanine | |
| Current | 1A | |
| Pitch | 1mm | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 64 | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Board-to-Board | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1mm | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 85°C | |
| Contact Gender | Male | |
| Standards/Approvals | No | |
| Voltage | 100 V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type PCB Header | ||
Series PMC Mezzanine | ||
Current 1A | ||
Pitch 1mm | ||
Housing Material Thermoplastic | ||
Number of Contacts 64 | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Board-to-Board | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1mm | ||
Termination Type Solder | ||
Maximum Operating Temperature 85°C | ||
Contact Gender Male | ||
Standards/Approvals No | ||
Voltage 100 V | ||
- COO (Country of Origin):
- US
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
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