Molex PMC Mezzanine Series Straight Surface PCB Socket, 64-Contact, 2 Row, 1 mm Pitch Solder
- RS 제품 번호:
- 797-6617
- Distrelec 제품 번호:
- 303-00-026
- 제조사 부품 번호:
- 71439-0864
- 제조업체:
- Molex
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대량 구매 할인 기용 가능
Subtotal (1 unit)*
₩8,384.80
재고있음
- 151 개 단위 배송 준비 완료
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수량 | 한팩당 |
|---|---|
| 1 - 24 | ₩8,384.80 |
| 25 - 99 | ₩8,140.40 |
| 100 - 249 | ₩7,877.20 |
| 250 - 499 | ₩7,670.40 |
| 500 + | ₩7,501.20 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 797-6617
- Distrelec 제품 번호:
- 303-00-026
- 제조사 부품 번호:
- 71439-0864
- 제조업체:
- Molex
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Number of Contacts | 64 | |
| Product Type | PCB Socket | |
| Sub Type | PCB Socket | |
| Number of Rows | 2 | |
| Pitch | 1mm | |
| Current | 1A | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Voltage | 100 V | |
| Series | PMC Mezzanine | |
| Row Pitch | 1mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | RoHS | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Number of Contacts 64 | ||
Product Type PCB Socket | ||
Sub Type PCB Socket | ||
Number of Rows 2 | ||
Pitch 1mm | ||
Current 1A | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Voltage 100 V | ||
Series PMC Mezzanine | ||
Row Pitch 1mm | ||
Minimum Operating Temperature -55°C | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Contact Gender Male | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- US
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
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