Amphenol Communications Solutions BergStak Series Straight Surface PCB Header, 120 Contact(s), 0.8 mm Pitch, 2 Row,
- RS 제품 번호:
- 182-2620
- 제조사 부품 번호:
- 61083-123402LF
- 제조업체:
- Amphenol Communications Solutions
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Subtotal (1 unit)*
₩8,140.40
일시적 품절
- 2026년 5월 14일 부터 배송
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수량 | 한팩당 |
|---|---|
| 1 - 112 | ₩8,140.40 |
| 113 - 224 | ₩7,971.20 |
| 225 + | ₩7,839.60 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 182-2620
- 제조사 부품 번호:
- 61083-123402LF
- 제조업체:
- Amphenol Communications Solutions
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Amphenol Communications Solutions | |
| Series | BergStak | |
| Product Type | PCB Header | |
| Pitch | 0.8mm | |
| Current | 800mA | |
| Number of Contacts | 120 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Board-to-Board | |
| Contact Material | Brass | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Solder | |
| Row Pitch | 0.8mm | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Male | |
| Standards/Approvals | No | |
| Voltage | 100 V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Amphenol Communications Solutions | ||
Series BergStak | ||
Product Type PCB Header | ||
Pitch 0.8mm | ||
Current 800mA | ||
Number of Contacts 120 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Board-to-Board | ||
Contact Material Brass | ||
Contact Plating Gold | ||
Minimum Operating Temperature -40°C | ||
Termination Type Solder | ||
Row Pitch 0.8mm | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Male | ||
Standards/Approvals No | ||
Voltage 100 V | ||
- COO (Country of Origin):
- CN
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
0.8 mm double-row contact pitch conserves printed circuit board space
Scoop-proof feature housings
Multiple plating options available
Multiple packaging options available
PCB locator pegs option
Lead-free
Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights
Suitable for parallel board stacking applications
Comprehensive range of sizes and stack heights to satisfy all needs
High density for all electrical applications needs
Prevents reverse mating
Satisfies different application requirement
Suitable for varies feeding processing
Facilitates ease and accuracy during manual assembly
BergStak® 0.80 mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 120 Positions.
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